In an automated tape substrate inspections, machine vision is widely adopted for high throughput and cost advantages. However, conventional methods are overly sensitive to foreign particles or have limitations in detecting three-dimensional defects such as top over-etched defect. Foreign particles such as dustsdo not affect the integrity of the final product and are often detected as defects during inspection. To complement vision inspection systems, a prototype fast and fine spatial resolution X-ray imaging sensor has been developed. This image sensor, based on an optoelectronic device the microchannel plate (MCP), has a spatial resolution of 20 μm and functions at frame rate of 30 fps. X-ray imaging is appropriate as it is virtually transparent to dust particles and provides information regarding the thickness of the copper wire patterns.
- Microchannel plate
- Tape substrate
ASJC Scopus subject areas
- Mechanical Engineering
- Electrical and Electronic Engineering