Development of a quantitative nanoscale thermal conductivity profiling technique by the removal of influence due to heat transfer through the air

Kyeongtae Kim, Jaehoon Chung, Gwangseok Hwang, Ohmyoung Kwon, Joon Sik Lee, Seungho Park, Young Ki Choi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We developed a quantitative thermal property profiling technique that measures the thermal property of the sample from the tip-sample heat transfer only using SThM. The principle of the technique is explained rigorously through a theoretical analysis of the heat transfer phenomena. The spatial resolution of this technique was demonstrated by obtaining the thermal conductivity profile of samples in which a thin silicon oxide layer is sandwiched between single crystal silicon layers. For a sample with 1.4 μm thick silicon oxide layer, its thermal conductivity was quantitatively profiled. However, for a sample with 100 nm thick silicon oxide layer, the obtained profile was not quantitative. From the experimental results the quantitative spatial resolution of this technique is estimated to be around 200 nm. In order to further improve the quantitative spatial resolution of this technique, the tip radius of the completed thermocouple SThM probe should be reduced further.

Original languageEnglish
Title of host publicationProceedings of the ASME Summer Heat Transfer Conference 2009, HT2009
Pages543-547
Number of pages5
DOIs
Publication statusPublished - 2009
Event2009 ASME Summer Heat Transfer Conference, HT2009 - San Francisco, CA, United States
Duration: 2009 Jul 192009 Jul 23

Publication series

NameProceedings of the ASME Summer Heat Transfer Conference 2009, HT2009
Volume1

Other

Other2009 ASME Summer Heat Transfer Conference, HT2009
CountryUnited States
CitySan Francisco, CA
Period09/7/1909/7/23

Keywords

  • Quantitative measurement
  • Scanning thermal microscope
  • Spatial resolution
  • Thermal conductivity

ASJC Scopus subject areas

  • Fluid Flow and Transfer Processes

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  • Cite this

    Kim, K., Chung, J., Hwang, G., Kwon, O., Lee, J. S., Park, S., & Choi, Y. K. (2009). Development of a quantitative nanoscale thermal conductivity profiling technique by the removal of influence due to heat transfer through the air. In Proceedings of the ASME Summer Heat Transfer Conference 2009, HT2009 (pp. 543-547). (Proceedings of the ASME Summer Heat Transfer Conference 2009, HT2009; Vol. 1). https://doi.org/10.1115/HT2009-88618