Development of abnormal grain growth in cold rolled and recrystallized AA 5182 sheet

H. G. Suk, E. J. Shin, M. Y. Huh

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

5 Citations (Scopus)

Abstract

Grain growth in the cold rolled and subsequently recrystallized AA 5182 sheets was investigated by means of microstructure observations and texture measurements. Grain growth behavior strongly depends on the annealing temperatures. Grain growth hardly took place at temperatures lower than 470°C, which is attributed to a low mobility of grain boundaries. Abnormal grain growth occurred at temperatures ranging from 480 to 530°C Annealing above 560°C gave rise to the dissolution of inhibitor precipitates, which led to normal grain growth.

Original languageEnglish
Title of host publicationSemi-Solid Processing of Alloys and Composites - Proceedings of the 9th International Conference on Semi-Solid Processing of Alloys and Composites, S2P 2006
PublisherTrans Tech Publications Ltd
Pages316-319
Number of pages4
ISBN (Print)3908451264, 9783908451266
Publication statusPublished - 2006
Event9th International Conference on Semi-Solid Processing of Alloys and Composites, S2P 2006 - Busan, Korea, Republic of
Duration: 2006 Sep 11 → 2006 Sep 13

Publication series

NameSolid State Phenomena
Volume116-117
ISSN (Print)1012-0394

Other

Other9th International Conference on Semi-Solid Processing of Alloys and Composites, S2P 2006
CountryKorea, Republic of
CityBusan
Period06/9/11 → 06/9/13

Keywords

  • Abnormal grain growth
  • Normal grain growth
  • Recrystallization
  • Texture

ASJC Scopus subject areas

  • Atomic and Molecular Physics, and Optics
  • Materials Science(all)
  • Condensed Matter Physics

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    Suk, H. G., Shin, E. J., & Huh, M. Y. (2006). Development of abnormal grain growth in cold rolled and recrystallized AA 5182 sheet. In Semi-Solid Processing of Alloys and Composites - Proceedings of the 9th International Conference on Semi-Solid Processing of Alloys and Composites, S2P 2006 (pp. 316-319). (Solid State Phenomena; Vol. 116-117). Trans Tech Publications Ltd.