Development of thin metal film deposition process for the intravascular catheter

Seok Chung, Jun Keun Chang, Dong Chul Han

Research output: Chapter in Book/Report/Conference proceedingChapter

1 Citation (Scopus)

Abstract

To make some MEMS devices such as sensors and actuators be useful in the medical application, it is required to integrate this devices with power or sensor lines and to keep the hole devices biocompatible. Integrating micro machined sensors and actuators with conventional copper lines is incompatible because the thin copper lines are not easy to handle in the mass production. To achieve the compatibility of wiring method between MEMS devices, we developed the thin metal film deposition process that coats micropatterned thin copper films on the non silicon-wafer substrate. The process was developed with the custom-made three-dimensional thin film sputter/evaporation system. The system consists of process chamber, two branch chambers, substrate holder unit and linear/rotary motion feedthrough. Thin metal film was deposited on the biocompatible polymer, polyurethane (Pellethane) and silicone, catheter that is 2 mm in diameter and 1,000 mm in length. We deposited Cr/Cu and Ti/Cu layer and made a comparative study of the deposition processes, sputtering and evaporation. The temperature of both the processes were maintained below 100°C, for the catheter not melting during the processes. To use the films as signal lines connect the signal source to the actuator on the catheter tip, we machined the films into desired patterns with the eximer laser. In this paper, we developed the thin metal film deposition system and processes for the biopolymeric substrate used in the medical MEMS devices.

Original languageEnglish
Title of host publicationAmerican Society of Mechanical Engineers, Bioengineering Division (Publication) BED
Place of PublicationFairfield, NJ, United States
PublisherASME
Pages65-66
Number of pages2
Volume43
ISBN (Print)0791816400
Publication statusPublished - 1999 Dec 1
Externally publishedYes
EventAdvances in Bioengineering - 1999 (The ASME International Mechanical Engineering Congress and Exposition) - Nashville, TN, USA
Duration: 1999 Nov 141999 Nov 19

Other

OtherAdvances in Bioengineering - 1999 (The ASME International Mechanical Engineering Congress and Exposition)
CityNashville, TN, USA
Period99/11/1499/11/19

Fingerprint

Catheters
Metals
MEMS
Actuators
Copper
Sensors
Evaporation
Substrates
Medical applications
Electric wiring
Silicon wafers
Silicones
Polyurethanes
Sputtering
Melting
Thin films
Lasers
Polymers

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Chung, S., Chang, J. K., & Han, D. C. (1999). Development of thin metal film deposition process for the intravascular catheter. In American Society of Mechanical Engineers, Bioengineering Division (Publication) BED (Vol. 43, pp. 65-66). Fairfield, NJ, United States: ASME.

Development of thin metal film deposition process for the intravascular catheter. / Chung, Seok; Chang, Jun Keun; Han, Dong Chul.

American Society of Mechanical Engineers, Bioengineering Division (Publication) BED. Vol. 43 Fairfield, NJ, United States : ASME, 1999. p. 65-66.

Research output: Chapter in Book/Report/Conference proceedingChapter

Chung, S, Chang, JK & Han, DC 1999, Development of thin metal film deposition process for the intravascular catheter. in American Society of Mechanical Engineers, Bioengineering Division (Publication) BED. vol. 43, ASME, Fairfield, NJ, United States, pp. 65-66, Advances in Bioengineering - 1999 (The ASME International Mechanical Engineering Congress and Exposition), Nashville, TN, USA, 99/11/14.
Chung S, Chang JK, Han DC. Development of thin metal film deposition process for the intravascular catheter. In American Society of Mechanical Engineers, Bioengineering Division (Publication) BED. Vol. 43. Fairfield, NJ, United States: ASME. 1999. p. 65-66
Chung, Seok ; Chang, Jun Keun ; Han, Dong Chul. / Development of thin metal film deposition process for the intravascular catheter. American Society of Mechanical Engineers, Bioengineering Division (Publication) BED. Vol. 43 Fairfield, NJ, United States : ASME, 1999. pp. 65-66
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