Differential-to-common mode conversion noise suppression with unit cell EBG structure for bended differential lines

Sangyeol Oh, Beomsoo Shin, Jaehyuk Lim, Seungjin Lee, Jae Hoon Lee

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

In order to reduce differential-to-common mode conversion noise in bended differential lines, we propose a unit cell electromagnetic bandgap (EBG) structure. The proposed structure compensates for mismatches of inductances and capacitances between inner and outer lines of the bended differential lines. Its performances of the common-mode noise suppression in frequency and time domains were verified by 3D full wave simulator, HFSS. Also, in order to verify the simulated results, the bended differential lines with the proposed unit cell EBG structure was fabricated and measured. As a result, suppression level of the differential-to-common mode conversion noise is below -20 dB from DC to 6 GHz, and Time-Domain-Through (TDT) common-mode noise voltage is reduced as compared with that of conventional bended differential lines.

Original languageEnglish
Title of host publication2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages103-105
Number of pages3
ISBN (Electronic)9781509061846
DOIs
Publication statusPublished - 2017 Apr 5
Event2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016 - Honolulu, United States
Duration: 2016 Dec 142016 Dec 16

Other

Other2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016
CountryUnited States
CityHonolulu
Period16/12/1416/12/16

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Modelling and Simulation

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    Oh, S., Shin, B., Lim, J., Lee, S., & Lee, J. H. (2017). Differential-to-common mode conversion noise suppression with unit cell EBG structure for bended differential lines. In 2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016 (pp. 103-105). [7893137] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EDAPS.2016.7893137