Differential to common mode conversion suppression using mushroom structure with asymmetric coupled line

Seungjin Lee, Sangyeol Oh, Beomsoo Shin, Jaehyuk Lim, Jaehoon Lee

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Right-angle bended differential line using mushroom structure with asymmetric coupled line (ACL) is proposed to suppress the differential to common mode conversion. The mushroom structure and ACL can compensate for self-capacitances and self-inductances of shorter inner line, respectively. Simulated results show that the differential to common mode noise conversion can be maintained under -20dB from DC to 5.96 GHz. Also, transient analysis is conducted to validate the performance of proposed design in time domain, and shows significant suppression of common mode noise. The common mode noise of proposed design is reduced from 129mV to 36mV as compared with conventional right-angle bended differential line. Furthermore, measured results are compared with simulated results and show good agreements.

Original languageEnglish
Title of host publication2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages115-117
Number of pages3
ISBN (Electronic)9781509061846
DOIs
Publication statusPublished - 2017 Apr 5
Event2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016 - Honolulu, United States
Duration: 2016 Dec 142016 Dec 16

Publication series

Name2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016

Other

Other2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016
Country/TerritoryUnited States
CityHonolulu
Period16/12/1416/12/16

Keywords

  • common mode noise
  • differential signaling
  • differential to common mode noise conversion
  • mushroom structure
  • right-angle bended differential line

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Modelling and Simulation

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