TY - JOUR
T1 - Differential-To-Common-Mode Conversion Suppression Using Mushroom Structure on Bent Differential Transmission Lines
AU - Lee, Seungjin
AU - Lim, Jaehyuk
AU - Oh, Sangyeol
AU - Kim, Yonghoon
AU - Oh, Dan
AU - Lee, Jaehoon
N1 - Funding Information:
Manuscript received June 28, 2018; revised November 23, 2018; accepted January 10, 2019. Date of publication January 25, 2019; date of current version April 1, 2019. This work was supported in part by the National Research Foundation of Korea through the Korea Government (MSIT) under Grant 2018R1D1A1B07049347 and Samsung Electronics, Inc. Recommended for publication by Associate Editor A. Weisshaar upon evaluation of reviewers’ comments. (Corresponding author: Jaehoon Lee.) S. Lee, J. Lim, S. Oh, and J. Lee are with the Department of Computer and Radio Communications Engineering, Korea University, Seoul 02841, South Korea (e-mail: ejhoon@korea.ac.kr).
PY - 2019/4
Y1 - 2019/4
N2 - In this paper, we propose a method to suppress differential-to-common-mode conversion noise from right-angle bent differential lines by installing a mushroom structure on the narrow inner line. We assessed the mode conversion noise suppression characteristics of the proposed structure by analyzing dispersion diagrams. The proposed structure exhibits differential-to-common-mode conversion (Sd21) below-20 dB up to 6 GHz, while Scd21 of conventional right-angle bent differential lines is only maintained below-20 dB for frequencies up to 1.04 GHz. In addition, we suggest that further enhancements of the mode conversion suppression bandwidth can be achieved by installing multiple distributed mushroom structures on right-angle bent differential lines. The use of multiple distributed mushrooms enabled us to achieve a wider frequency bandwidth by compensating more fully for the phase difference between the inner and outer lines. Therefore, the right-angle bent differential lines with multiple distributed mushrooms can suppress mode conversion noise under-20 dB up to 10 GHz. We assessed the performance of our proposed structure by conducting measurements in both the frequency and time domains. We obtained a good agreement between our experimental and numerical results. In addition, we measured eye diagrams to demonstrate that the proposed structures suppress differential-to-common-mode conversion noise without degrading the differential signaling quality.
AB - In this paper, we propose a method to suppress differential-to-common-mode conversion noise from right-angle bent differential lines by installing a mushroom structure on the narrow inner line. We assessed the mode conversion noise suppression characteristics of the proposed structure by analyzing dispersion diagrams. The proposed structure exhibits differential-to-common-mode conversion (Sd21) below-20 dB up to 6 GHz, while Scd21 of conventional right-angle bent differential lines is only maintained below-20 dB for frequencies up to 1.04 GHz. In addition, we suggest that further enhancements of the mode conversion suppression bandwidth can be achieved by installing multiple distributed mushroom structures on right-angle bent differential lines. The use of multiple distributed mushrooms enabled us to achieve a wider frequency bandwidth by compensating more fully for the phase difference between the inner and outer lines. Therefore, the right-angle bent differential lines with multiple distributed mushrooms can suppress mode conversion noise under-20 dB up to 10 GHz. We assessed the performance of our proposed structure by conducting measurements in both the frequency and time domains. We obtained a good agreement between our experimental and numerical results. In addition, we measured eye diagrams to demonstrate that the proposed structures suppress differential-to-common-mode conversion noise without degrading the differential signaling quality.
KW - Bend discontinuity
KW - common-mode noise
KW - differential signaling
KW - differential-to-common-mode conversion noise
KW - mushroom structure
KW - right-angle bent differential lines
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U2 - 10.1109/TCPMT.2019.2895310
DO - 10.1109/TCPMT.2019.2895310
M3 - Article
AN - SCOPUS:85063885310
VL - 9
SP - 702
EP - 711
JO - IEEE Transactions on Components, Packaging and Manufacturing Technology
JF - IEEE Transactions on Components, Packaging and Manufacturing Technology
SN - 2156-3950
IS - 4
M1 - 8626495
ER -