Direct bonding between spacer and field emitter array using an electron-beam evaporated interlayer

Heung Woo Park, Byeong Kwon Ju, Yun Hi Lee, In Byeong Kang, N. Samaan, M. R. Haskard, Jung Ho Park, Myung Hwan Oh

Research output: Contribution to journalConference articlepeer-review

1 Citation (Scopus)

Abstract

This work reports a direct bonding method between silicon wafers using an interlayer. Thermal oxide, sputtered silicon nitride, molybdenum film and electron-beam evaporated silicon oxide were used as an interlayer. Silicon wafers were hydrophilized by one of the hot nitric acid, the sulfuric acid based solution and the ammonium hydroxide based solution, mated at class 100 hemisphere and heat treated. After hydrophilization of silicon wafers, the changes of the surface roughness' were studied by the atomic force microscopy(AFM) and the voids and the non-bonded areas were inspected by the infra-red(IR) transmission microscope. The bonding interfaces of the bonded pairs were inspected by a high resolution scanning electron microscope(SEM). Surface energies and tensile strengths of the bonded pairs were also tested by the crack propagation method and the push-pull meter, respectively. Surface energy of the Si-Si wafer pair annealed at 150 °C for 48 hours was about 7200 [erg/cm2] and its tensile strength was more than 18 MPa. This tensile strength is comparable with the bulk strength of the used silicon wafer.

Original languageEnglish
Pages (from-to)328-335
Number of pages8
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume3046
DOIs
Publication statusPublished - 1997 Jun 19
EventSmart Structures and Materials 1997: Smart Electronics and MEMS - San Diego, United States
Duration: 1997 Mar 31997 Mar 6

Keywords

  • Direct bonding
  • Hydrophilization
  • Interlayer
  • Micro-electro-mechanical systems
  • Silicon-on insulators

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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