Dynamic deadband control in semiconductor manufacturing

Hyo Heon Ko, Jihyun Kim, Jun-Geol Baek, Sung Shick Kim

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper proposes efficient control method to minimize process error and to reduce process variance in semiconductor manufacturing. Photo-lithography process make more detailed complex circuit in semiconductor process and is important for quality. However, obstacles were in the process of the facility itself, vibration, wear and tear, and product and process change and environmental impact are difficult to control. In addition, the existing process that is being used for a series of statistical techniques to control the problem was amplified for the change. Therefore, this paper propose effective process control method for reducing process variance by reducing the unnecessary obstacles, quickly detecting changes in the fair, and accurately reflect the degree of change. This study proposes the dynamic deadband control that has a region (band) to detect the status of a process of change and, according to detect changes in the region itself moves the process control. In this research, the semiconductor manufacturing company is supported to perform a more precise control and reduction of fluctuations due to be producing products of uniform quality. Also it can contribute to yield due to the quality incensement, and more and more minted the process control in semiconductor.

Original languageEnglish
Title of host publication2009 IEEE International Symposium on Assembly and Manufacturing, ISAM 2009
Pages412-416
Number of pages5
DOIs
Publication statusPublished - 2009 Dec 1
Event2009 IEEE International Symposium on Assembly and Manufacturing, ISAM 2009 - Seoul, Korea, Republic of
Duration: 2009 Nov 172009 Nov 20

Other

Other2009 IEEE International Symposium on Assembly and Manufacturing, ISAM 2009
CountryKorea, Republic of
CitySeoul
Period09/11/1709/11/20

Fingerprint

Semiconductor materials
Process control
Lithography
Environmental impact
Wear of materials
Networks (circuits)
Industry

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering

Cite this

Ko, H. H., Kim, J., Baek, J-G., & Kim, S. S. (2009). Dynamic deadband control in semiconductor manufacturing. In 2009 IEEE International Symposium on Assembly and Manufacturing, ISAM 2009 (pp. 412-416). [5376977] https://doi.org/10.1109/ISAM.2009.5376977

Dynamic deadband control in semiconductor manufacturing. / Ko, Hyo Heon; Kim, Jihyun; Baek, Jun-Geol; Kim, Sung Shick.

2009 IEEE International Symposium on Assembly and Manufacturing, ISAM 2009. 2009. p. 412-416 5376977.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Ko, HH, Kim, J, Baek, J-G & Kim, SS 2009, Dynamic deadband control in semiconductor manufacturing. in 2009 IEEE International Symposium on Assembly and Manufacturing, ISAM 2009., 5376977, pp. 412-416, 2009 IEEE International Symposium on Assembly and Manufacturing, ISAM 2009, Seoul, Korea, Republic of, 09/11/17. https://doi.org/10.1109/ISAM.2009.5376977
Ko HH, Kim J, Baek J-G, Kim SS. Dynamic deadband control in semiconductor manufacturing. In 2009 IEEE International Symposium on Assembly and Manufacturing, ISAM 2009. 2009. p. 412-416. 5376977 https://doi.org/10.1109/ISAM.2009.5376977
Ko, Hyo Heon ; Kim, Jihyun ; Baek, Jun-Geol ; Kim, Sung Shick. / Dynamic deadband control in semiconductor manufacturing. 2009 IEEE International Symposium on Assembly and Manufacturing, ISAM 2009. 2009. pp. 412-416
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