Abstract
This paper proposes efficient control method to minimize process error and to reduce process variance in semiconductor manufacturing. Photo-lithography process make more detailed complex circuit in semiconductor process and is important for quality. However, obstacles were in the process of the facility itself, vibration, wear and tear, and product and process change and environmental impact are difficult to control. In addition, the existing process that is being used for a series of statistical techniques to control the problem was amplified for the change. Therefore, this paper propose effective process control method for reducing process variance by reducing the unnecessary obstacles, quickly detecting changes in the fair, and accurately reflect the degree of change. This study proposes the dynamic deadband control that has a region (band) to detect the status of a process of change and, according to detect changes in the region itself moves the process control. In this research, the semiconductor manufacturing company is supported to perform a more precise control and reduction of fluctuations due to be producing products of uniform quality. Also it can contribute to yield due to the quality incensement, and more and more minted the process control in semiconductor.
| Original language | English |
|---|---|
| Title of host publication | 2009 IEEE International Symposium on Assembly and Manufacturing, ISAM 2009 |
| Pages | 412-416 |
| Number of pages | 5 |
| DOIs | |
| Publication status | Published - 2009 Dec 1 |
| Event | 2009 IEEE International Symposium on Assembly and Manufacturing, ISAM 2009 - Seoul, Korea, Republic of Duration: 2009 Nov 17 → 2009 Nov 20 |
Other
| Other | 2009 IEEE International Symposium on Assembly and Manufacturing, ISAM 2009 |
|---|---|
| Country | Korea, Republic of |
| City | Seoul |
| Period | 09/11/17 → 09/11/20 |
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ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Industrial and Manufacturing Engineering
Cite this
Dynamic deadband control in semiconductor manufacturing. / Ko, Hyo Heon; Kim, Jihyun; Baek, Jun-Geol; Kim, Sung Shick.
2009 IEEE International Symposium on Assembly and Manufacturing, ISAM 2009. 2009. p. 412-416 5376977.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Dynamic deadband control in semiconductor manufacturing
AU - Ko, Hyo Heon
AU - Kim, Jihyun
AU - Baek, Jun-Geol
AU - Kim, Sung Shick
PY - 2009/12/1
Y1 - 2009/12/1
N2 - This paper proposes efficient control method to minimize process error and to reduce process variance in semiconductor manufacturing. Photo-lithography process make more detailed complex circuit in semiconductor process and is important for quality. However, obstacles were in the process of the facility itself, vibration, wear and tear, and product and process change and environmental impact are difficult to control. In addition, the existing process that is being used for a series of statistical techniques to control the problem was amplified for the change. Therefore, this paper propose effective process control method for reducing process variance by reducing the unnecessary obstacles, quickly detecting changes in the fair, and accurately reflect the degree of change. This study proposes the dynamic deadband control that has a region (band) to detect the status of a process of change and, according to detect changes in the region itself moves the process control. In this research, the semiconductor manufacturing company is supported to perform a more precise control and reduction of fluctuations due to be producing products of uniform quality. Also it can contribute to yield due to the quality incensement, and more and more minted the process control in semiconductor.
AB - This paper proposes efficient control method to minimize process error and to reduce process variance in semiconductor manufacturing. Photo-lithography process make more detailed complex circuit in semiconductor process and is important for quality. However, obstacles were in the process of the facility itself, vibration, wear and tear, and product and process change and environmental impact are difficult to control. In addition, the existing process that is being used for a series of statistical techniques to control the problem was amplified for the change. Therefore, this paper propose effective process control method for reducing process variance by reducing the unnecessary obstacles, quickly detecting changes in the fair, and accurately reflect the degree of change. This study proposes the dynamic deadband control that has a region (band) to detect the status of a process of change and, according to detect changes in the region itself moves the process control. In this research, the semiconductor manufacturing company is supported to perform a more precise control and reduction of fluctuations due to be producing products of uniform quality. Also it can contribute to yield due to the quality incensement, and more and more minted the process control in semiconductor.
UR - http://www.scopus.com/inward/record.url?scp=77949375910&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=77949375910&partnerID=8YFLogxK
U2 - 10.1109/ISAM.2009.5376977
DO - 10.1109/ISAM.2009.5376977
M3 - Conference contribution
AN - SCOPUS:77949375910
SN - 9781424446278
SP - 412
EP - 416
BT - 2009 IEEE International Symposium on Assembly and Manufacturing, ISAM 2009
ER -