Effect of cross-interaction between Ni and Cu on growth kinetics of intermetallic compounds in Ni/Sn/Cu diffusion couples during aging

K. K. Hong, J. B. Ryu, C. Y. Park, Joo Youl Huh

Research output: Contribution to journalArticle

29 Citations (Scopus)

Abstract

The solid-state, cross-interaction between the Ni layer on the component side and the Cu pad on the printed circuit board (PCB) side in ball grid array (BGA) solder joints was investigated by employing Ni(15 μm)/Sn(65 μm)/Cu ternary diffusion couples. The ternary diffusion couples were prepared by sequentially electroplating Sn and Ni on a Cu foil and were aged isothermally at 150, 180, and 200°C. The growth of the intermetallic compound (IMC) layer on the Ni side was coupled with that on the Cu side by the mass flux across the Sn layer that was caused by the difference in the Ni content between the (Cu 1-x Ni x ) 6Sn 5 layer on the Ni side and the (Cu 1-y Ni y ) 6Sn 5 layer on the Cu side. As the consequence of the coupling, the growth rate of the (Cu 1-x Ni x ) 6 Sn 5 layer on the Ni side was rapidly accelerated by decreasing Sn layer thickness and increasing aging temperature. Owing to the cross-interaction with the top Ni layer, the growth rate of the (Cu 1-y Ni y ) 6Sn 5 layer on the Cu side was accelerated at 150°C and 180°C but was retarded at 200°C, while the growth rate of the Cu 3Sn layer was always retarded. The growth kinetic model proposed in an attempt to interpret the experimental results was able to reproduce qualitatively all of the important experimental observations pertaining to the growth of the IMC layers in the Ni/Sn/Cu diffusion couple.

Original languageEnglish
Pages (from-to)61-72
Number of pages12
JournalJournal of Electronic Materials
Volume37
Issue number1
DOIs
Publication statusPublished - 2008 Jan 1

Fingerprint

Growth kinetics
Intermetallics
intermetallics
Aging of materials
kinetics
Ball grid arrays
interactions
Electroplating
Printed circuit boards
Soldering alloys
Metal foil
Mass transfer
Temperature
electroplating
printed circuits
circuit boards
solders
balls
foils
grids

Keywords

  • Ball-grid-array solder joint
  • Growth kinetics
  • Ni/Sn/Cu diffusion couple
  • Solid-state cross-interaction
  • Ternary intermetallic compound

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Materials Science(all)
  • Physics and Astronomy (miscellaneous)

Cite this

Effect of cross-interaction between Ni and Cu on growth kinetics of intermetallic compounds in Ni/Sn/Cu diffusion couples during aging. / Hong, K. K.; Ryu, J. B.; Park, C. Y.; Huh, Joo Youl.

In: Journal of Electronic Materials, Vol. 37, No. 1, 01.01.2008, p. 61-72.

Research output: Contribution to journalArticle

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