Effect of Cu-containing solders on the critical IMC thickness for the shear strength of BGA solder joints

Chang Keun Shin, Joo Youl Huh

Research output: Chapter in Book/Report/Conference proceedingConference contribution

11 Citations (Scopus)

Abstract

Shear strengths of BGA solder joints on Cu bond pads were studied for Sn-Cu solders with various compositions of 0, 1.5 and 2.5wt.% Cu. Focuses were placed on the effects of the intermetallic compound (IMC) layer thickness and the interface roughness between IMC layers and solders. Ball shear tests were performed both for as-soldered solder joints with soldering reaction times of 7, 15, 30, 60, and 120 sec at 270°C and for aged solder joints at 150°C for up to 16 days. During the soldering reactions, the Cu-containing solders enhanced considerably both the IMC layer growth and the solder/IMC interface roughness. Upon aging for 1 day, however, the effect of the Cu content of solders on the IMC layer growth and the interface roughness nearly disappeared. The critical thickness of the IMC layer for the maximum shear strength was about 1.2 μm for all three solders. At the critical IMC layer thickness, the shearing fracture occurred inside solder balls. As the IMC layer thickness deviated from the critical thickness, the fracture tended to occur near the solder/IMC interface and thus the solder/IMC interface roughness had an influence on the shear strength.

Original languageEnglish
Title of host publicationProceedings of the Electronic Packaging Technology Conference, EPTC
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages406-411
Number of pages6
Volume2000-January
ISBN (Print)0780366441
DOIs
Publication statusPublished - 2000
Event3rd Electronics Packaging Technology Conference, EPTC 2000 - Singapore, Singapore
Duration: 2000 Dec 52000 Dec 7

Other

Other3rd Electronics Packaging Technology Conference, EPTC 2000
CountrySingapore
CitySingapore
Period00/12/500/12/7

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Keywords

  • Aging
  • Bonding
  • Copper
  • Electronics packaging
  • Intermetallic
  • Mechanical factors
  • Morphology
  • Soldering
  • Temperature
  • Testing

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics

Cite this

Shin, C. K., & Huh, J. Y. (2000). Effect of Cu-containing solders on the critical IMC thickness for the shear strength of BGA solder joints. In Proceedings of the Electronic Packaging Technology Conference, EPTC (Vol. 2000-January, pp. 406-411). [906408] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EPTC.2000.906408