Effect of curing temperature on the adhesion strength of polyamideimide/copper joints

Jinhan Cho, D. I. Kong, C. E. Park, M. Y. Jin

Research output: Contribution to journalArticle

11 Citations (Scopus)

Abstract

The adhesion strength of polyamideimide (PAI)/copper joints was investigated as a function of the curing temperature and time The adhesion strength decreased as the thermal stress increased with the increase of both curing temperature and time. The effects of copper oxide formed by thermal treatment and alkaline treatment on the adhesion strength of PAI/copper joints were examined. The adhesion strength decreased with thermally oxidized copper and increased with alkalioxidized copper. The locus of failure of PAI/copper joints was also studied by scanning electron microscopy (SEM) and X-ray photoelectron spectroscopy (XPS). The locus of failure appears to be partially cohesive in both PAI and copper oxide.

Original languageEnglish
Pages (from-to)507-521
Number of pages15
JournalJournal of Adhesion Science and Technology
Volume12
Issue number5
Publication statusPublished - 1998 Dec 1
Externally publishedYes

Fingerprint

Polyamideimides
Bond strength (materials)
curing
Curing
Copper
adhesion
Joints
copper
Temperature
Copper oxides
copper oxides
loci
temperature
Oxides
Hot Temperature
thermal stresses
Thermal stress
Photoelectron Spectroscopy
X ray photoelectron spectroscopy
Heat treatment

Keywords

  • Adhesion strength
  • Copper
  • Copper oxide
  • Polyamideimide (PAI)
  • Thermal stress

ASJC Scopus subject areas

  • Chemical Engineering(all)
  • Computational Mechanics
  • Mechanics of Materials
  • Materials Science(all)
  • Surfaces, Coatings and Films
  • Materials Chemistry
  • Chemistry(all)
  • Surfaces and Interfaces

Cite this

Effect of curing temperature on the adhesion strength of polyamideimide/copper joints. / Cho, Jinhan; Kong, D. I.; Park, C. E.; Jin, M. Y.

In: Journal of Adhesion Science and Technology, Vol. 12, No. 5, 01.12.1998, p. 507-521.

Research output: Contribution to journalArticle

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