Effect of curing temperature on the adhesion strength of polyamideimide/copper joints

J. H. Cho, D. I. Kong, C. E. Park, M. Y. Jin

Research output: Contribution to journalArticle

12 Citations (Scopus)

Fingerprint Dive into the research topics of 'Effect of curing temperature on the adhesion strength of polyamideimide/copper joints'. Together they form a unique fingerprint.

Chemical Compounds

Engineering & Materials Science

Physics & Astronomy

Medicine & Life Sciences