Effect of displacement and humidity on contact resistance of copper electrical contacts

I. H. Sung, J. W. Kim, H. J. Noh, Ho Jang

Research output: Contribution to journalArticle

25 Citations (Scopus)

Abstract

The effect of displacement and humidity on fretting-induced instability of electrical contact resistance (Rc) was studied. A fretting tester was used to examine Rc in partial and gross slip modes. Under the partial slip regime the contact failure was susceptible to the displacement and moisture effectively increased contact stability, which was pronounced at smaller displacements. In the gross slip mode, however, humidity effect was relatively small. The early contact failure at low humidity was attributed to the wear debris agglomeration within the sliding interface, suggesting a high propensity of electrical contact failure at dry conditions.

Original languageEnglish
Pages (from-to)256-261
Number of pages6
JournalTribology International
Volume95
DOIs
Publication statusPublished - 2016 Mar 1

Keywords

  • Contact area
  • Contact resistance
  • Fretting
  • Humidity

ASJC Scopus subject areas

  • Mechanical Engineering
  • Mechanics of Materials
  • Surfaces, Coatings and Films
  • Surfaces and Interfaces

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