Effect of fabrication on high cycle fatigue properties of copper thin films

Jun Hyub Park, Joong Hyok An, Yun-Jae Kim, Hyeon Chang Choi

Research output: Contribution to journalArticle

6 Citations (Scopus)

Abstract

The influence of fabrication on the tensile and fatigue behavior of copper films manufactured by 3 kinds of fabrication methods was investigated. The tensile and high cycle fatigue tests were performed using the test machine developed by authors. Young's moduli (72, 71 and 69 GPa, respectively) are lower than the literature values (108-145 GPa), while the yield strengths were as high as 358, 350 and 346 MPa, respectively and the ultimate strengths as 462, 456 and 446 MPa, respectively. There is not much difference in the tensile properties of the 3 kinds of films. There is little difference in the fatigue properties of the 3 kinds of films but one of them has shorter fatigue life than others in high cycle region and longer fatigue life than others in low cycle region.

Original languageEnglish
Pages (from-to)318-326
Number of pages9
JournalActa Mechanica Solida Sinica
Volume21
Issue number4
DOIs
Publication statusPublished - 2008 Aug 1

Fingerprint

Fatigue of materials
Copper
Fabrication
Thin films
Tensile properties
Yield stress
Elastic moduli

Keywords

  • copper
  • high cycle fatigue test
  • mechanical properties
  • thin film

ASJC Scopus subject areas

  • Computational Mechanics
  • Mechanical Engineering
  • Mechanics of Materials

Cite this

Effect of fabrication on high cycle fatigue properties of copper thin films. / Park, Jun Hyub; An, Joong Hyok; Kim, Yun-Jae; Choi, Hyeon Chang.

In: Acta Mechanica Solida Sinica, Vol. 21, No. 4, 01.08.2008, p. 318-326.

Research output: Contribution to journalArticle

Park, Jun Hyub ; An, Joong Hyok ; Kim, Yun-Jae ; Choi, Hyeon Chang. / Effect of fabrication on high cycle fatigue properties of copper thin films. In: Acta Mechanica Solida Sinica. 2008 ; Vol. 21, No. 4. pp. 318-326.
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