Effect of oxygen plasma treatment on anodic bonding

Seung Woo Choi, Woo Beom Choi, Yun-Hi Lee, Byeong Kwon Ju, Byong Ho Kim

Research output: Contribution to journalArticle

13 Citations (Scopus)

Abstract

Oxygen plasma surface treatment of silicon and glass was studied for improving the characteristics of anodic bonding. By using the sessile drop method, we confirmed that the surfaces activated by the oxygen plasma were rendered hydrophilic even at low r.f. power or short plasma exposure time. With increasing plasma power and exposure time the surface roughness was observed to increase. The oxygen plasma treatment was significantly efficient in reducing the impurities on the surface, which caused degradation in the bonding strength and the electrical property in interface. In the tensile test, the oxygen plasma treatment led to a higher bonding strength than the conventional anodic bonding method.

Original languageEnglish
Pages (from-to)207-209
Number of pages3
JournalJournal of the Korean Physical Society
Volume38
Issue number3
Publication statusPublished - 2001 Mar 1
Externally publishedYes

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oxygen plasma
tensile tests
surface treatment
surface roughness
electrical properties
degradation
impurities
glass
silicon

ASJC Scopus subject areas

  • Physics and Astronomy(all)

Cite this

Effect of oxygen plasma treatment on anodic bonding. / Choi, Seung Woo; Choi, Woo Beom; Lee, Yun-Hi; Ju, Byeong Kwon; Kim, Byong Ho.

In: Journal of the Korean Physical Society, Vol. 38, No. 3, 01.03.2001, p. 207-209.

Research output: Contribution to journalArticle

Choi, Seung Woo ; Choi, Woo Beom ; Lee, Yun-Hi ; Ju, Byeong Kwon ; Kim, Byong Ho. / Effect of oxygen plasma treatment on anodic bonding. In: Journal of the Korean Physical Society. 2001 ; Vol. 38, No. 3. pp. 207-209.
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