Effect of texturing process involving saw-damage etching on crystalline silicon solar cells

Hyunho Kim, Sungeun Park, Byungjun Kang, Seongtak Kim, Sung Ju Tark, Donghwan Kim, S. S. Dahiwale

Research output: Contribution to journalArticle

16 Citations (Scopus)

Abstract

For high efficiency silicon solar cells, surface texturing is used to increase the short circuit current by reducing the surface reflection loss. Surface texturing is an anisotropic wet chemical etching process commonly used to form random pyramids. We investigated how the process is affected by surface conditions. We also compared the texturing behavior and cell performances of as-cut, polished and saw-damage etched wafers. Textured samples with different processing times were analyzed to detect pyramids and determine weighted reflectances. After the texturing process, conventional screen-printed solar cells were fabricated to observe the cell performance. The pseudo I-V curves and quantum efficiency for the samples were analyzed. Performance of samples with different surface conditions makes no difference. Thus, the processing-cost of solar cells can be reduced by omitting the saw-damage etching process.

Original languageEnglish
Pages (from-to)133-137
Number of pages5
JournalApplied Surface Science
Volume284
DOIs
Publication statusPublished - 2013 Nov 1

Keywords

  • Crystalline silicon solar cells
  • Saw-damage etching
  • Surface texturing

ASJC Scopus subject areas

  • Chemistry(all)
  • Condensed Matter Physics
  • Physics and Astronomy(all)
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films

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