Abstract
In this letter, the effect of the work function difference between various top electrodes (TE-Ni, W, Ti, and Al) and the Pt bottom electrode, ΔΦM, on the resistive switching (RS) of SiN thin films was investigated. The cells with W and Ti TEs showed stable RS, but others failed to show RS. In particular, the Ti TE exhibited low operating currents (∼2μ A) and good retention properties (<∼ 104 s at 85° C). On the basis of the analysis of conduction mechanisms, it is found that stable RS of SiN films might be strongly related to the activation energy of traps induced by ΔΦM. Thus, the RS properties of the SiN films can be improved by engineering ΔΦM without additional processes.
Original language | English |
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Article number | 6563100 |
Pages (from-to) | 1181-1183 |
Number of pages | 3 |
Journal | IEEE Electron Device Letters |
Volume | 34 |
Issue number | 9 |
DOIs | |
Publication status | Published - 2013 |
Keywords
- Activation energy of traps
- resistive random access memories (RRAM)
- resistive switching
- silicon nitride
- work function difference
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering