Effective heat dissipation and geometric optimization in an LED module with aluminum nitride (AlN) insulation plate

Min Woo Jeong, Seung Won Jeon, Sang Hun Lee, Yong Chan Kim

Research output: Contribution to journalArticle

28 Citations (Scopus)


The heat dissipation performance in a conventional chip on board (COB) LED module is limited by the very low thermal conductivity of the dielectric layer. In this study, an enhanced model is proposed to achieve effective heat dissipation using an aluminum nitride (AlN) insulation plate instead of the dielectric layer. Initially, the geometric configuration of the enhanced model was optimized by using response surface methodology. The effects of each design parameter were also analyzed in terms of the one-dimensional and spreading thermal resistances. In the optimized enhanced model, the junction temperature and total thermal resistance were 24.1% and 55.2% lower, respectively, than the conventional COB module with the copper-based substrate. At the heat input of 15 W, the luminous efficacy of the optimized enhanced model was about 13.9% higher than that of the conventional COB module.

Original languageEnglish
Pages (from-to)212-219
Number of pages8
JournalApplied Thermal Engineering
Publication statusPublished - 2015 Feb 5


ASJC Scopus subject areas

  • Energy Engineering and Power Technology
  • Industrial and Manufacturing Engineering

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