Effects of Ni3Sn4 and (Cu,Ni)6Sn 5 intermetallic layers on cross-interaction between Pd and Ni in solder joints

Yong Ho Baek, Bo Mook Chung, Young Sik Choi, Jaeho Choi, Joo Youl Huh

Research output: Contribution to journalArticle

8 Citations (Scopus)

Abstract

We examined the effects of layers of intermetallic compound (IMC) Ni 3Sn4 and (Cu,Ni)6Sn5 formed at the solder/Ni interface, on the cross-interactions between Pd and Ni during solid-state aging and reflow soldering. Two types of diffusion couples, Pd/Sn/Ni and Pd/Sn-Cu/Ni, were aged at 150 °C to study the solidstate interactions. In contrast to the Pd/Sn/Ni couples in which a Ni3Sn4 layer formed at the Ni interface, the Pd/Sn-Cu/Ni couple where a (Cu,Ni) 6Sn5 layer formed at the Ni interface exhibited no significant interaction between Pd and Ni. The (Cu,Ni)6Sn5 layer acted as an effective barrier against Ni diffusion and thus inhibited the resettlement of (Pd,Ni)Sn4 onto the Ni interface. For the interaction during reflow, Sn-3.5Ag and Sn-3.0Ag-0.5Cu solder balls were isothermally reflowed on an electroless Ni(P)/electroless Pd/immersion Au (ENEPIG) surface finish at 250 °C, and the dissolution kinetics of the (Pd,Ni)Sn4 particles converted from the 0.2-μm-thick Pd-finish layer were examined. The spalled (Pd,Ni)Sn4 particles very quickly dissolved into the molten solder when the IMC layer formed on the Ni substrate was (Cu,Ni)6Sn5 rather than Ni3Sn4. The dependence of the dissolution kinetics of the spalled (Pd,Ni)Sn4 particles on the IMC layers was rationalized on the basis of a Sn-Ni-Pd isotherm at 250 °C. The present study suggests that the formation of a dense (Cu,Ni)6Sn5 layer at the solder/Ni interface can effectively alleviate the (Pd,Ni)Sn4-related degradation of solder joint reliability.

Original languageEnglish
Pages (from-to)75-81
Number of pages7
JournalJournal of Alloys and Compounds
Volume579
DOIs
Publication statusPublished - 2013 Jun 6

Fingerprint

Soldering alloys
Intermetallics
Dissolution
Kinetics
Soldering
Isotherms
Molten materials
Aging of materials
Degradation
Substrates

Keywords

  • Cross-interaction
  • Diffusion barrier
  • Ni(P)/Pd/Au surface finish
  • Pb-free solder
  • Pd resettlement

ASJC Scopus subject areas

  • Mechanical Engineering
  • Mechanics of Materials
  • Materials Chemistry
  • Metals and Alloys

Cite this

Effects of Ni3Sn4 and (Cu,Ni)6Sn 5 intermetallic layers on cross-interaction between Pd and Ni in solder joints. / Baek, Yong Ho; Chung, Bo Mook; Choi, Young Sik; Choi, Jaeho; Huh, Joo Youl.

In: Journal of Alloys and Compounds, Vol. 579, 06.06.2013, p. 75-81.

Research output: Contribution to journalArticle

@article{2be5f59ccee84ddb9286480b5450bdde,
title = "Effects of Ni3Sn4 and (Cu,Ni)6Sn 5 intermetallic layers on cross-interaction between Pd and Ni in solder joints",
abstract = "We examined the effects of layers of intermetallic compound (IMC) Ni 3Sn4 and (Cu,Ni)6Sn5 formed at the solder/Ni interface, on the cross-interactions between Pd and Ni during solid-state aging and reflow soldering. Two types of diffusion couples, Pd/Sn/Ni and Pd/Sn-Cu/Ni, were aged at 150 °C to study the solidstate interactions. In contrast to the Pd/Sn/Ni couples in which a Ni3Sn4 layer formed at the Ni interface, the Pd/Sn-Cu/Ni couple where a (Cu,Ni) 6Sn5 layer formed at the Ni interface exhibited no significant interaction between Pd and Ni. The (Cu,Ni)6Sn5 layer acted as an effective barrier against Ni diffusion and thus inhibited the resettlement of (Pd,Ni)Sn4 onto the Ni interface. For the interaction during reflow, Sn-3.5Ag and Sn-3.0Ag-0.5Cu solder balls were isothermally reflowed on an electroless Ni(P)/electroless Pd/immersion Au (ENEPIG) surface finish at 250 °C, and the dissolution kinetics of the (Pd,Ni)Sn4 particles converted from the 0.2-μm-thick Pd-finish layer were examined. The spalled (Pd,Ni)Sn4 particles very quickly dissolved into the molten solder when the IMC layer formed on the Ni substrate was (Cu,Ni)6Sn5 rather than Ni3Sn4. The dependence of the dissolution kinetics of the spalled (Pd,Ni)Sn4 particles on the IMC layers was rationalized on the basis of a Sn-Ni-Pd isotherm at 250 °C. The present study suggests that the formation of a dense (Cu,Ni)6Sn5 layer at the solder/Ni interface can effectively alleviate the (Pd,Ni)Sn4-related degradation of solder joint reliability.",
keywords = "Cross-interaction, Diffusion barrier, Ni(P)/Pd/Au surface finish, Pb-free solder, Pd resettlement",
author = "Baek, {Yong Ho} and Chung, {Bo Mook} and Choi, {Young Sik} and Jaeho Choi and Huh, {Joo Youl}",
year = "2013",
month = "6",
day = "6",
doi = "10.1016/j.jallcom.2013.05.055",
language = "English",
volume = "579",
pages = "75--81",
journal = "Journal of Alloys and Compounds",
issn = "0925-8388",
publisher = "Elsevier BV",

}

TY - JOUR

T1 - Effects of Ni3Sn4 and (Cu,Ni)6Sn 5 intermetallic layers on cross-interaction between Pd and Ni in solder joints

AU - Baek, Yong Ho

AU - Chung, Bo Mook

AU - Choi, Young Sik

AU - Choi, Jaeho

AU - Huh, Joo Youl

PY - 2013/6/6

Y1 - 2013/6/6

N2 - We examined the effects of layers of intermetallic compound (IMC) Ni 3Sn4 and (Cu,Ni)6Sn5 formed at the solder/Ni interface, on the cross-interactions between Pd and Ni during solid-state aging and reflow soldering. Two types of diffusion couples, Pd/Sn/Ni and Pd/Sn-Cu/Ni, were aged at 150 °C to study the solidstate interactions. In contrast to the Pd/Sn/Ni couples in which a Ni3Sn4 layer formed at the Ni interface, the Pd/Sn-Cu/Ni couple where a (Cu,Ni) 6Sn5 layer formed at the Ni interface exhibited no significant interaction between Pd and Ni. The (Cu,Ni)6Sn5 layer acted as an effective barrier against Ni diffusion and thus inhibited the resettlement of (Pd,Ni)Sn4 onto the Ni interface. For the interaction during reflow, Sn-3.5Ag and Sn-3.0Ag-0.5Cu solder balls were isothermally reflowed on an electroless Ni(P)/electroless Pd/immersion Au (ENEPIG) surface finish at 250 °C, and the dissolution kinetics of the (Pd,Ni)Sn4 particles converted from the 0.2-μm-thick Pd-finish layer were examined. The spalled (Pd,Ni)Sn4 particles very quickly dissolved into the molten solder when the IMC layer formed on the Ni substrate was (Cu,Ni)6Sn5 rather than Ni3Sn4. The dependence of the dissolution kinetics of the spalled (Pd,Ni)Sn4 particles on the IMC layers was rationalized on the basis of a Sn-Ni-Pd isotherm at 250 °C. The present study suggests that the formation of a dense (Cu,Ni)6Sn5 layer at the solder/Ni interface can effectively alleviate the (Pd,Ni)Sn4-related degradation of solder joint reliability.

AB - We examined the effects of layers of intermetallic compound (IMC) Ni 3Sn4 and (Cu,Ni)6Sn5 formed at the solder/Ni interface, on the cross-interactions between Pd and Ni during solid-state aging and reflow soldering. Two types of diffusion couples, Pd/Sn/Ni and Pd/Sn-Cu/Ni, were aged at 150 °C to study the solidstate interactions. In contrast to the Pd/Sn/Ni couples in which a Ni3Sn4 layer formed at the Ni interface, the Pd/Sn-Cu/Ni couple where a (Cu,Ni) 6Sn5 layer formed at the Ni interface exhibited no significant interaction between Pd and Ni. The (Cu,Ni)6Sn5 layer acted as an effective barrier against Ni diffusion and thus inhibited the resettlement of (Pd,Ni)Sn4 onto the Ni interface. For the interaction during reflow, Sn-3.5Ag and Sn-3.0Ag-0.5Cu solder balls were isothermally reflowed on an electroless Ni(P)/electroless Pd/immersion Au (ENEPIG) surface finish at 250 °C, and the dissolution kinetics of the (Pd,Ni)Sn4 particles converted from the 0.2-μm-thick Pd-finish layer were examined. The spalled (Pd,Ni)Sn4 particles very quickly dissolved into the molten solder when the IMC layer formed on the Ni substrate was (Cu,Ni)6Sn5 rather than Ni3Sn4. The dependence of the dissolution kinetics of the spalled (Pd,Ni)Sn4 particles on the IMC layers was rationalized on the basis of a Sn-Ni-Pd isotherm at 250 °C. The present study suggests that the formation of a dense (Cu,Ni)6Sn5 layer at the solder/Ni interface can effectively alleviate the (Pd,Ni)Sn4-related degradation of solder joint reliability.

KW - Cross-interaction

KW - Diffusion barrier

KW - Ni(P)/Pd/Au surface finish

KW - Pb-free solder

KW - Pd resettlement

UR - http://www.scopus.com/inward/record.url?scp=84878410693&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84878410693&partnerID=8YFLogxK

U2 - 10.1016/j.jallcom.2013.05.055

DO - 10.1016/j.jallcom.2013.05.055

M3 - Article

AN - SCOPUS:84878410693

VL - 579

SP - 75

EP - 81

JO - Journal of Alloys and Compounds

JF - Journal of Alloys and Compounds

SN - 0925-8388

ER -