Effects of Ni3Sn4 and (Cu,Ni)6Sn 5 intermetallic layers on cross-interaction between Pd and Ni in solder joints

Yong Ho Baek, Bo Mook Chung, Young Sik Choi, Jaeho Choi, Joo Youl Huh

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10 Citations (Scopus)

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Chemical Compounds

Engineering & Materials Science