Effects of process parameters on the adhesion of copper film on polyethylene tetrephthalate(pet) substrate prepared by ECRMOCVD coupled with a periodic DC bias

Jin Hyun, Bup Ju Jeon, Dongjin Byun, Joong Kee Lee

Research output: Contribution to journalConference article

Abstract

Characteristics of Cu/C:H films on the PET substrate prepared by ECR-MOCVD coupled with a DC bias under Cu(hfac)2-Ar-H2 was investigated with special attention to process parameters. Our results showed that the Cu/C:H film has strongly adhere with the polymer substrate by chemical bonding and exhibited wide range of electrical conductivity that could be controlled by process parameters. The increase in H2/Ar ratio, microwave power and negative DC bias voltage brought on the higher pulling strength between Cu/C:H films and PET substrate. The effects of surface pretreatments of polymer substrate on pulling strength were insignificant in the range of our experimental range.

Original languageEnglish
Pages (from-to)105-110
Number of pages6
JournalMaterials Research Society Symposium - Proceedings
Volume795
DOIs
Publication statusPublished - 2003
EventThin Films - Stresses and Mechanical Properties X - Boston, MA., United States
Duration: 2003 Dec 12003 Dec 5

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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