Effects of process parameters on the adhesion of copper film on polyethylene tetrephthalate(pet) substrate prepared by ECRMOCVD coupled with a periodic DC bias

Jin Hyun, Bup Ju Jeon, Dong Jin Byun, Joong Kee Lee

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Characteristics of Cu/C:H films on the PET substrate prepared by ECR-MOCVD coupled with a DC bias under Cu(hfac) 2-Ar-H 2 was investigated with special attention to process parameters. Our results showed that the Cu/C:H film has strongly adhere with the polymer substrate by chemical bonding and exhibited wide range of electrical conductivity that could be controlled by process parameters. The increase in H 2/Ar ratio, microwave power and negative DC bias voltage brought on the higher pulling strength between Cu/C:H films and PET substrate. The effects of surface pretreatments of polymer substrate on pulling strength were insignificant in the range of our experimental range.

Original languageEnglish
Title of host publicationMaterials Research Society Symposium - Proceedings
EditorsS.G. Corcoran, Y.-C. Joo, N.R. Moody, Z. Suo
Pages105-110
Number of pages6
Volume795
Publication statusPublished - 2003
EventThin Films - Stresses and Mechanical Properties X - Boston, MA., United States
Duration: 2003 Dec 12003 Dec 5

Other

OtherThin Films - Stresses and Mechanical Properties X
CountryUnited States
CityBoston, MA.
Period03/12/103/12/5

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ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials

Cite this

Hyun, J., Jeon, B. J., Byun, D. J., & Lee, J. K. (2003). Effects of process parameters on the adhesion of copper film on polyethylene tetrephthalate(pet) substrate prepared by ECRMOCVD coupled with a periodic DC bias. In S. G. Corcoran, Y-C. Joo, N. R. Moody, & Z. Suo (Eds.), Materials Research Society Symposium - Proceedings (Vol. 795, pp. 105-110)