Effects of processing temperatures of nickel plating on capacitance density of alumina film capacitor

Myung Sun Jeong, Byeong Kwon Ju, Jeon Kook Lee

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Abstract

We observed the effects of nickel plating temperatures for controlling the surface morphologies of the deposited nickel layers on the alumina nano-pores. The alumina nano-channels were filled with nickel at various processing temperatures of 60∼90 °C. The electrical properties of the alumina film capacitors were changed with processing temperatures. The electroless nickel plating (ENP) at 60 °C improved the nickel penetration into the alumina nano-channels due to the reduced reaction rate. Nickel layers are uniformly formed on the high aspect ratio alumina pores. Due to the uniform nickel electrode, the capacitance density of the alumina film capacitors is improved by the low leakage current, dissipation factor and equivalent series resistance. Alumina film capacitors made by ENP at 60 °C had a high capacitance density of 160 nF/cm2.

Original languageEnglish
Pages (from-to)4530-4533
Number of pages4
JournalJournal of Nanoscience and Nanotechnology
Volume15
Issue number6
DOIs
Publication statusPublished - 2015 Jun 1

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ASJC Scopus subject areas

  • Condensed Matter Physics
  • Chemistry(all)
  • Materials Science(all)
  • Bioengineering
  • Biomedical Engineering

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