Electric field assembled anisotropic alumina composite for thermal dissipation applications

Myong Jae Yoo, Dong Seok Seo, Seong Hwan Kim, Woo Sung Lee, Tae Geun Seong, Sang Hyo Kweon, Byoung Jik Jeong, Young Hun Jeong, Sahn Nahm

Research output: Contribution to journalArticlepeer-review

10 Citations (Scopus)

Abstract

A composite material with anisotropic microstructure was fabricated by DC electric field. Alumina was used as filler for thermal conductivity and polysiloxane resin was used as matrix. According to the alumina morphology and loading amount, various anisotropic microstructures were assembled. The thermal properties of the composite material were investigated parallel to the direction of the applied electric field accordingly. For plate-like alumina with 20 vol% loading, a thermal conductivity of 0.44 W/mK was achieved. With spherically shaped alumina, with an equal loading of 20 vol%, a higher thermal conductivity of 0.46 W/mK was achieved. The increase in the thermal conductivity of the fabricated alumina composites with anisotropic microstructure was attributed to increased filler-to-filler connectivity.

Original languageEnglish
Pages (from-to)201-208
Number of pages8
JournalJournal of Composite Materials
Volume48
Issue number2
DOIs
Publication statusPublished - 2014 Jan

Keywords

  • Polymer-matrix composites
  • anisotropy
  • ceramic-matrix composites
  • functional composites

ASJC Scopus subject areas

  • Ceramics and Composites
  • Mechanics of Materials
  • Mechanical Engineering
  • Materials Chemistry

Fingerprint Dive into the research topics of 'Electric field assembled anisotropic alumina composite for thermal dissipation applications'. Together they form a unique fingerprint.

Cite this