Electric field assembled anisotropic dielectric layer for metal core printed circuit boards

Myong Jae Yoo, Hyun Min Cho, Seong Hwan Kim, Ho Sun Lim, Seong Dae Park, Woo Sung Lee, Jin Seong Kim, Tae Geun Seong, Byoung Jik Jeong, Sahn Nahm

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

Thermal dissipation properties of metal core printed circuit boards (MCPCBs) with a dielectric layer having an anisotropically assembled microstructure are presented for dissipating heat of high-power transistors. The proposed MCPCB with an anisotropic microstructure was fabricated by applying an electric field simultaneously during the hot-pressing process. The effect of the anisotropically assembled microstructure of the dielectric layer compared with the conventionally fabricated dielectric layer was an increase in thermal diffusivity by the enhanced connectivity of fillers. Thermal transient measurements of high-power transistors with the proposed MCPCB were compared with those of high-power transistors with a conventional MCPCB. The developed MCPCB showed better heat dissipation performance and lower thermal resistance.

Original languageEnglish
Article number6311422
Pages (from-to)1607-1609
Number of pages3
JournalIEEE Electron Device Letters
Volume33
Issue number11
DOIs
Publication statusPublished - 2012 Oct 4

Fingerprint

Printed circuit boards
Metals
Electric fields
Microstructure
Thermal diffusivity
Hot pressing
Heat losses
Heat resistance
Fillers
Hot Temperature
Power transistors

Keywords

  • Anisotropic assemble
  • composite
  • heat dissipation
  • high-power device
  • metal core printed circuit board (MCPCB)
  • thermal resistance

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Electric field assembled anisotropic dielectric layer for metal core printed circuit boards. / Yoo, Myong Jae; Cho, Hyun Min; Kim, Seong Hwan; Lim, Ho Sun; Park, Seong Dae; Lee, Woo Sung; Kim, Jin Seong; Seong, Tae Geun; Jeong, Byoung Jik; Nahm, Sahn.

In: IEEE Electron Device Letters, Vol. 33, No. 11, 6311422, 04.10.2012, p. 1607-1609.

Research output: Contribution to journalArticle

Yoo, MJ, Cho, HM, Kim, SH, Lim, HS, Park, SD, Lee, WS, Kim, JS, Seong, TG, Jeong, BJ & Nahm, S 2012, 'Electric field assembled anisotropic dielectric layer for metal core printed circuit boards', IEEE Electron Device Letters, vol. 33, no. 11, 6311422, pp. 1607-1609. https://doi.org/10.1109/LED.2012.2212872
Yoo, Myong Jae ; Cho, Hyun Min ; Kim, Seong Hwan ; Lim, Ho Sun ; Park, Seong Dae ; Lee, Woo Sung ; Kim, Jin Seong ; Seong, Tae Geun ; Jeong, Byoung Jik ; Nahm, Sahn. / Electric field assembled anisotropic dielectric layer for metal core printed circuit boards. In: IEEE Electron Device Letters. 2012 ; Vol. 33, No. 11. pp. 1607-1609.
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