Electrical characteristics of carbon nanotube network fabricated by a simple transfer method

Sun Kug Kim, Sang Min Park, Doo Hee Hwang, Dong Kyu Jang, Raushan Koizhaiganova, Siegmar Roth, Cheol Jin Lee

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

We demonstrated a simple transfer method enables to fabricate the single-walled carbon nanotube (SWCNT) film on the plastic substrate. SWCNT network was separated from the initial substrate and transferred onto another substrate using the nitric acid. We also found that electrical conductivity of transferred film was improved. The sheet resistance of SWCNT films was changed from a 150-300 Ω/sq to a 80-150 Ω/sq after transferring the SWCNT film in the range of 70-80% transmittance. This is contributed to the densification of the SWCNT network. During the transfer process, the nitric acid fills the voids between the tubes and form homogeneous interfaces among the tubes, liquid and air. Pressure differences at the interface exert bending moments to the tubes and induce deformation. By the way, deformation leads to reduce the distance between the tubes and it is stuck together due to the van der Waals forces. We suggest that this transfer method provides electrically improved SWCNT films as well as easy, contrallable and inexpensive way to fabricate. This work can open up new possibility for the flexible electronics.

Original languageEnglish
Title of host publicationINEC 2010 - 2010 3rd International Nanoelectronics Conference, Proceedings
Pages696-697
Number of pages2
DOIs
Publication statusPublished - 2010
Event2010 3rd International Nanoelectronics Conference, INEC 2010 - Hongkong, China
Duration: 2010 Jan 32010 Jan 8

Publication series

NameINEC 2010 - 2010 3rd International Nanoelectronics Conference, Proceedings

Other

Other2010 3rd International Nanoelectronics Conference, INEC 2010
CountryChina
CityHongkong
Period10/1/310/1/8

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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