Electrical characterization of ball grid array packages from S-parameter measurements below 500 MHz

Jichai Jeong, J. Jeong

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

We report electrical characterization of ball grid array (BGA) packages from only 1-port S-parameter measurements below 500 MHz. Capacitance, inductance and resistance of transmission lines in the packages are extracted. Extracted capacitances are compared with those from simulations and measurements at the low frequency.

Original languageEnglish
Title of host publicationIEEE Topical Meeting on Electrical Performance of Electronic Packaging
Place of PublicationPiscataway, NJ, United States
PublisherIEEE
Pages61-64
Number of pages4
Publication statusPublished - 1998 Dec 1
EventProceedings of the 1998 IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging - West Point, NY, USA
Duration: 1998 Oct 261998 Oct 28

Other

OtherProceedings of the 1998 IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging
CityWest Point, NY, USA
Period98/10/2698/10/28

Fingerprint

Ball grid arrays
Scattering parameters
Capacitance
Inductance
Electric lines

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Jeong, J., & Jeong, J. (1998). Electrical characterization of ball grid array packages from S-parameter measurements below 500 MHz. In IEEE Topical Meeting on Electrical Performance of Electronic Packaging (pp. 61-64). Piscataway, NJ, United States: IEEE.

Electrical characterization of ball grid array packages from S-parameter measurements below 500 MHz. / Jeong, Jichai; Jeong, J.

IEEE Topical Meeting on Electrical Performance of Electronic Packaging. Piscataway, NJ, United States : IEEE, 1998. p. 61-64.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Jeong, J & Jeong, J 1998, Electrical characterization of ball grid array packages from S-parameter measurements below 500 MHz. in IEEE Topical Meeting on Electrical Performance of Electronic Packaging. IEEE, Piscataway, NJ, United States, pp. 61-64, Proceedings of the 1998 IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging, West Point, NY, USA, 98/10/26.
Jeong J, Jeong J. Electrical characterization of ball grid array packages from S-parameter measurements below 500 MHz. In IEEE Topical Meeting on Electrical Performance of Electronic Packaging. Piscataway, NJ, United States: IEEE. 1998. p. 61-64
Jeong, Jichai ; Jeong, J. / Electrical characterization of ball grid array packages from S-parameter measurements below 500 MHz. IEEE Topical Meeting on Electrical Performance of Electronic Packaging. Piscataway, NJ, United States : IEEE, 1998. pp. 61-64
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