Electrical characterization of ball grid array packages from S-parameter measurements below 500 MHz

J. Jeong, J. Jeong

Research output: Contribution to conferencePaper

1 Citation (Scopus)

Abstract

We report electrical characterization of ball grid array (BGA) packages from only 1-port S-parameter measurements below 500 MHz. Capacitance, inductance and resistance of transmission lines in the packages are extracted. Extracted capacitances are compared with those from simulations and measurements at the low frequency.

Original languageEnglish
Pages61-64
Number of pages4
Publication statusPublished - 1998
EventProceedings of the 1998 IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging - West Point, NY, USA
Duration: 1998 Oct 261998 Oct 28

Other

OtherProceedings of the 1998 IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging
CityWest Point, NY, USA
Period98/10/2698/10/28

ASJC Scopus subject areas

  • Engineering(all)

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    Jeong, J., & Jeong, J. (1998). Electrical characterization of ball grid array packages from S-parameter measurements below 500 MHz. 61-64. Paper presented at Proceedings of the 1998 IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging, West Point, NY, USA, .