Abstract
To electrically characterize ball grid array (BGA) packages, one-port S-parameter measurements have been performed. Equivalent circuit parameters using the Γ and T models are extracted from measured S-parameters for three different frequency ranges. The accuracy of two selected equivalent circuits is evaluated by comparison between the re-calculated S11 using the extracted equivalent circuit parameters and measured S-parameters. The results show that the T lumped model can be used to represent S- parameters of BGA packages without distributed elements up to 2 GHz.
| Original language | English |
|---|---|
| Pages (from-to) | 271-276 |
| Number of pages | 6 |
| Journal | Current Applied Physics |
| Volume | 5 |
| Issue number | 3 |
| DOIs | |
| Publication status | Published - 2005 Mar |
Keywords
- Capacitances
- Circuit modeling
- Inductances
- Packaging
ASJC Scopus subject areas
- Materials Science(all)
- Physics and Astronomy(all)
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Nam, S., Lee, J., Kim, Y., Tchah, K. H., Jeong, J., & Jeong, J. (2005). Electrical modeling of ball grid array packages based on one-port S-parameter measurement for electrical evaluation of high-speed test board. Current Applied Physics, 5(3), 271-276. https://doi.org/10.1016/j.cap.2003.09.025