Electrical modeling of ball grid array packages based on one-port S-parameter measurement for electrical evaluation of high-speed test board

Seungki Nam; Jaehoon Lee; Yonggyoo Kim; Kyun Hyun Tchah; Jaeyong Jeong; Jichai Jeong

doi:10.1016/j.cap.2003.09.025

Electrical modeling of ball grid array packages based on one-port S-parameter measurement for electrical evaluation of high-speed test board

Seungki Nam, Jaehoon Lee, Yonggyoo Kim, Kyun Hyun Tchah, Jaeyong Jeong, Jichai Jeong

Research output: Contribution to journal › Article › peer-review

Abstract

To electrically characterize ball grid array (BGA) packages, one-port S-parameter measurements have been performed. Equivalent circuit parameters using the Γ and T models are extracted from measured S-parameters for three different frequency ranges. The accuracy of two selected equivalent circuits is evaluated by comparison between the re-calculated S11 using the extracted equivalent circuit parameters and measured S-parameters. The results show that the T lumped model can be used to represent S- parameters of BGA packages without distributed elements up to 2 GHz.

Original language	English
Pages (from-to)	271-276
Number of pages	6
Journal	Current Applied Physics
Volume	5
Issue number	3
DOIs	https://doi.org/10.1016/j.cap.2003.09.025
Publication status	Published - 2005 Mar

Keywords

Capacitances
Circuit modeling
Inductances
Packaging

ASJC Scopus subject areas

Materials Science(all)
Physics and Astronomy(all)

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title = "Electrical modeling of ball grid array packages based on one-port S-parameter measurement for electrical evaluation of high-speed test board",

abstract = "To electrically characterize ball grid array (BGA) packages, one-port S-parameter measurements have been performed. Equivalent circuit parameters using the Γ and T models are extracted from measured S-parameters for three different frequency ranges. The accuracy of two selected equivalent circuits is evaluated by comparison between the re-calculated S11 using the extracted equivalent circuit parameters and measured S-parameters. The results show that the T lumped model can be used to represent S- parameters of BGA packages without distributed elements up to 2 GHz.",

keywords = "Capacitances, Circuit modeling, Inductances, Packaging",

author = "Seungki Nam and Jaehoon Lee and Yonggyoo Kim and Tchah, {Kyun Hyun} and Jaeyong Jeong and Jichai Jeong",

year = "2005",

month = mar,

doi = "10.1016/j.cap.2003.09.025",

language = "English",

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pages = "271--276",

journal = "Current Applied Physics",

issn = "1567-1739",

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T1 - Electrical modeling of ball grid array packages based on one-port S-parameter measurement for electrical evaluation of high-speed test board

AU - Nam, Seungki

AU - Lee, Jaehoon

AU - Kim, Yonggyoo

AU - Tchah, Kyun Hyun

AU - Jeong, Jaeyong

AU - Jeong, Jichai

PY - 2005/3

Y1 - 2005/3

N2 - To electrically characterize ball grid array (BGA) packages, one-port S-parameter measurements have been performed. Equivalent circuit parameters using the Γ and T models are extracted from measured S-parameters for three different frequency ranges. The accuracy of two selected equivalent circuits is evaluated by comparison between the re-calculated S11 using the extracted equivalent circuit parameters and measured S-parameters. The results show that the T lumped model can be used to represent S- parameters of BGA packages without distributed elements up to 2 GHz.

AB - To electrically characterize ball grid array (BGA) packages, one-port S-parameter measurements have been performed. Equivalent circuit parameters using the Γ and T models are extracted from measured S-parameters for three different frequency ranges. The accuracy of two selected equivalent circuits is evaluated by comparison between the re-calculated S11 using the extracted equivalent circuit parameters and measured S-parameters. The results show that the T lumped model can be used to represent S- parameters of BGA packages without distributed elements up to 2 GHz.

KW - Capacitances

KW - Circuit modeling

KW - Inductances

KW - Packaging

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