Electrical modeling of ball grid array packages based on one-port S-parameter measurement for electrical evaluation of high-speed test board

Seungki Nam, Jae Hoon Lee, Yonggyoo Kim, Kyun Hyun Tchah, Jaeyong Jeong, Jichai Jeong

Research output: Contribution to journalArticle

Abstract

To electrically characterize ball grid array (BGA) packages, one-port S-parameter measurements have been performed. Equivalent circuit parameters using the Γ and T models are extracted from measured S-parameters for three different frequency ranges. The accuracy of two selected equivalent circuits is evaluated by comparison between the re-calculated S11 using the extracted equivalent circuit parameters and measured S-parameters. The results show that the T lumped model can be used to represent S- parameters of BGA packages without distributed elements up to 2 GHz.

Original languageEnglish
Pages (from-to)271-276
Number of pages6
JournalCurrent Applied Physics
Volume5
Issue number3
DOIs
Publication statusPublished - 2005 Mar 1

    Fingerprint

Keywords

  • Capacitances
  • Circuit modeling
  • Inductances
  • Packaging

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Surfaces and Interfaces
  • Materials Science (miscellaneous)

Cite this