Abstract
Embossing lithography is one of the most promising technologies for mass production of nano-scale structures. To advance the industrialization of embossing lithography, fabrication of low cost, high mechanical strength embossing template is essential. Electroformed Ni template can be used as an embossing template if its poor anti-adhesive property is fixed by proper releasing layer treatment, especially, when it is used with sticky thermoset polymer. In this experiment, quartz master template with 200nm to 2um sized surface protrusions was fabricated and used to emboss the PMMA coated Si wafer. Then the embossed PMMA layer was coated with metal seed layer (Ni) and electroplating of Ni was followed to fabricate Ni template. To apply anti-stiction SAM layer, SiO2 and Si layer was coated on Ni template. With proper anti-stiction treatment of Ni template, sub-micron patterns were successfully transferred to sticky thermoset polymers such as epoxy resin using Ni template without any degradation of anti-adhesive property.
| Original language | English |
|---|---|
| Title of host publication | Diffusion and Defect Data Pt.B: Solid State Phenomena |
| Pages | 147-151 |
| Number of pages | 5 |
| Volume | 124-126 |
| Edition | PART 1 |
| Publication status | Published - 2007 Dec 1 |
| Event | IUMRS International Conference in Asia 2006, IUMRS-ICA 2006 - Jeju, Korea, Republic of Duration: 2006 Sep 10 → 2006 Sep 14 |
Publication series
| Name | Diffusion and Defect Data Pt.B: Solid State Phenomena |
|---|---|
| Number | PART 1 |
| Volume | 124-126 |
| ISSN (Print) | 10120394 |
Other
| Other | IUMRS International Conference in Asia 2006, IUMRS-ICA 2006 |
|---|---|
| Country | Korea, Republic of |
| City | Jeju |
| Period | 06/9/10 → 06/9/14 |
Fingerprint
Keywords
- Anti-adhesive layer
- Electroforming
- Embossing lithography
- Epoxy resin
- Nickel template
- SAM coating
- Thermoset polymer
ASJC Scopus subject areas
- Materials Science(all)
- Physics and Astronomy (miscellaneous)
- Condensed Matter Physics
- Electronic, Optical and Magnetic Materials
Cite this
Embossing lithography on sticky thermost polymer using Ni template. / Byeon, Kyeongjae; Hong, Sunghoon; Yang, Kiyeon; Ra, Seunghyun; Ahn, Jinho; Lee, Heon.
Diffusion and Defect Data Pt.B: Solid State Phenomena. Vol. 124-126 PART 1. ed. 2007. p. 147-151 (Diffusion and Defect Data Pt.B: Solid State Phenomena; Vol. 124-126, No. PART 1).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Embossing lithography on sticky thermost polymer using Ni template
AU - Byeon, Kyeongjae
AU - Hong, Sunghoon
AU - Yang, Kiyeon
AU - Ra, Seunghyun
AU - Ahn, Jinho
AU - Lee, Heon
PY - 2007/12/1
Y1 - 2007/12/1
N2 - Embossing lithography is one of the most promising technologies for mass production of nano-scale structures. To advance the industrialization of embossing lithography, fabrication of low cost, high mechanical strength embossing template is essential. Electroformed Ni template can be used as an embossing template if its poor anti-adhesive property is fixed by proper releasing layer treatment, especially, when it is used with sticky thermoset polymer. In this experiment, quartz master template with 200nm to 2um sized surface protrusions was fabricated and used to emboss the PMMA coated Si wafer. Then the embossed PMMA layer was coated with metal seed layer (Ni) and electroplating of Ni was followed to fabricate Ni template. To apply anti-stiction SAM layer, SiO2 and Si layer was coated on Ni template. With proper anti-stiction treatment of Ni template, sub-micron patterns were successfully transferred to sticky thermoset polymers such as epoxy resin using Ni template without any degradation of anti-adhesive property.
AB - Embossing lithography is one of the most promising technologies for mass production of nano-scale structures. To advance the industrialization of embossing lithography, fabrication of low cost, high mechanical strength embossing template is essential. Electroformed Ni template can be used as an embossing template if its poor anti-adhesive property is fixed by proper releasing layer treatment, especially, when it is used with sticky thermoset polymer. In this experiment, quartz master template with 200nm to 2um sized surface protrusions was fabricated and used to emboss the PMMA coated Si wafer. Then the embossed PMMA layer was coated with metal seed layer (Ni) and electroplating of Ni was followed to fabricate Ni template. To apply anti-stiction SAM layer, SiO2 and Si layer was coated on Ni template. With proper anti-stiction treatment of Ni template, sub-micron patterns were successfully transferred to sticky thermoset polymers such as epoxy resin using Ni template without any degradation of anti-adhesive property.
KW - Anti-adhesive layer
KW - Electroforming
KW - Embossing lithography
KW - Epoxy resin
KW - Nickel template
KW - SAM coating
KW - Thermoset polymer
UR - http://www.scopus.com/inward/record.url?scp=34247558463&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=34247558463&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:34247558463
SN - 3908451310
SN - 9783908451310
VL - 124-126
T3 - Diffusion and Defect Data Pt.B: Solid State Phenomena
SP - 147
EP - 151
BT - Diffusion and Defect Data Pt.B: Solid State Phenomena
ER -