Embossing lithography on sticky thermost polymer using Ni template

Kyeongjae Byeon, Sunghoon Hong, Kiyeon Yang, Seunghyun Ra, Jinho Ahn, Heon Lee

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

Embossing lithography is one of the most promising technologies for mass production of nano-scale structures. To advance the industrialization of embossing lithography, fabrication of low cost, high mechanical strength embossing template is essential. Electroformed Ni template can be used as an embossing template if its poor anti-adhesive property is fixed by proper releasing layer treatment, especially, when it is used with sticky thermoset polymer. In this experiment, quartz master template with 200nm to 2um sized surface protrusions was fabricated and used to emboss the PMMA coated Si wafer. Then the embossed PMMA layer was coated with metal seed layer (Ni) and electroplating of Ni was followed to fabricate Ni template. To apply anti-stiction SAM layer, SiO2 and Si layer was coated on Ni template. With proper anti-stiction treatment of Ni template, sub-micron patterns were successfully transferred to sticky thermoset polymers such as epoxy resin using Ni template without any degradation of anti-adhesive property.

Original languageEnglish
Title of host publicationDiffusion and Defect Data Pt.B: Solid State Phenomena
Pages147-151
Number of pages5
Volume124-126
EditionPART 1
Publication statusPublished - 2007 Dec 1
EventIUMRS International Conference in Asia 2006, IUMRS-ICA 2006 - Jeju, Korea, Republic of
Duration: 2006 Sep 102006 Sep 14

Publication series

NameDiffusion and Defect Data Pt.B: Solid State Phenomena
NumberPART 1
Volume124-126
ISSN (Print)10120394

Other

OtherIUMRS International Conference in Asia 2006, IUMRS-ICA 2006
CountryKorea, Republic of
CityJeju
Period06/9/1006/9/14

Fingerprint

Stiction
embossing
Thermosets
Polymethyl Methacrylate
Lithography
Adhesives
Polymers
templates
lithography
Epoxy Resins
Quartz
polymers
Electroplating
Epoxy resins
Strength of materials
Seed
Metals
stiction
Fabrication
Degradation

Keywords

  • Anti-adhesive layer
  • Electroforming
  • Embossing lithography
  • Epoxy resin
  • Nickel template
  • SAM coating
  • Thermoset polymer

ASJC Scopus subject areas

  • Materials Science(all)
  • Physics and Astronomy (miscellaneous)
  • Condensed Matter Physics
  • Electronic, Optical and Magnetic Materials

Cite this

Byeon, K., Hong, S., Yang, K., Ra, S., Ahn, J., & Lee, H. (2007). Embossing lithography on sticky thermost polymer using Ni template. In Diffusion and Defect Data Pt.B: Solid State Phenomena (PART 1 ed., Vol. 124-126, pp. 147-151). (Diffusion and Defect Data Pt.B: Solid State Phenomena; Vol. 124-126, No. PART 1).

Embossing lithography on sticky thermost polymer using Ni template. / Byeon, Kyeongjae; Hong, Sunghoon; Yang, Kiyeon; Ra, Seunghyun; Ahn, Jinho; Lee, Heon.

Diffusion and Defect Data Pt.B: Solid State Phenomena. Vol. 124-126 PART 1. ed. 2007. p. 147-151 (Diffusion and Defect Data Pt.B: Solid State Phenomena; Vol. 124-126, No. PART 1).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Byeon, K, Hong, S, Yang, K, Ra, S, Ahn, J & Lee, H 2007, Embossing lithography on sticky thermost polymer using Ni template. in Diffusion and Defect Data Pt.B: Solid State Phenomena. PART 1 edn, vol. 124-126, Diffusion and Defect Data Pt.B: Solid State Phenomena, no. PART 1, vol. 124-126, pp. 147-151, IUMRS International Conference in Asia 2006, IUMRS-ICA 2006, Jeju, Korea, Republic of, 06/9/10.
Byeon K, Hong S, Yang K, Ra S, Ahn J, Lee H. Embossing lithography on sticky thermost polymer using Ni template. In Diffusion and Defect Data Pt.B: Solid State Phenomena. PART 1 ed. Vol. 124-126. 2007. p. 147-151. (Diffusion and Defect Data Pt.B: Solid State Phenomena; PART 1).
Byeon, Kyeongjae ; Hong, Sunghoon ; Yang, Kiyeon ; Ra, Seunghyun ; Ahn, Jinho ; Lee, Heon. / Embossing lithography on sticky thermost polymer using Ni template. Diffusion and Defect Data Pt.B: Solid State Phenomena. Vol. 124-126 PART 1. ed. 2007. pp. 147-151 (Diffusion and Defect Data Pt.B: Solid State Phenomena; PART 1).
@inproceedings{184e121ae5784c03bc6c89618c759897,
title = "Embossing lithography on sticky thermost polymer using Ni template",
abstract = "Embossing lithography is one of the most promising technologies for mass production of nano-scale structures. To advance the industrialization of embossing lithography, fabrication of low cost, high mechanical strength embossing template is essential. Electroformed Ni template can be used as an embossing template if its poor anti-adhesive property is fixed by proper releasing layer treatment, especially, when it is used with sticky thermoset polymer. In this experiment, quartz master template with 200nm to 2um sized surface protrusions was fabricated and used to emboss the PMMA coated Si wafer. Then the embossed PMMA layer was coated with metal seed layer (Ni) and electroplating of Ni was followed to fabricate Ni template. To apply anti-stiction SAM layer, SiO2 and Si layer was coated on Ni template. With proper anti-stiction treatment of Ni template, sub-micron patterns were successfully transferred to sticky thermoset polymers such as epoxy resin using Ni template without any degradation of anti-adhesive property.",
keywords = "Anti-adhesive layer, Electroforming, Embossing lithography, Epoxy resin, Nickel template, SAM coating, Thermoset polymer",
author = "Kyeongjae Byeon and Sunghoon Hong and Kiyeon Yang and Seunghyun Ra and Jinho Ahn and Heon Lee",
year = "2007",
month = "12",
day = "1",
language = "English",
isbn = "3908451310",
volume = "124-126",
series = "Diffusion and Defect Data Pt.B: Solid State Phenomena",
number = "PART 1",
pages = "147--151",
booktitle = "Diffusion and Defect Data Pt.B: Solid State Phenomena",
edition = "PART 1",

}

TY - GEN

T1 - Embossing lithography on sticky thermost polymer using Ni template

AU - Byeon, Kyeongjae

AU - Hong, Sunghoon

AU - Yang, Kiyeon

AU - Ra, Seunghyun

AU - Ahn, Jinho

AU - Lee, Heon

PY - 2007/12/1

Y1 - 2007/12/1

N2 - Embossing lithography is one of the most promising technologies for mass production of nano-scale structures. To advance the industrialization of embossing lithography, fabrication of low cost, high mechanical strength embossing template is essential. Electroformed Ni template can be used as an embossing template if its poor anti-adhesive property is fixed by proper releasing layer treatment, especially, when it is used with sticky thermoset polymer. In this experiment, quartz master template with 200nm to 2um sized surface protrusions was fabricated and used to emboss the PMMA coated Si wafer. Then the embossed PMMA layer was coated with metal seed layer (Ni) and electroplating of Ni was followed to fabricate Ni template. To apply anti-stiction SAM layer, SiO2 and Si layer was coated on Ni template. With proper anti-stiction treatment of Ni template, sub-micron patterns were successfully transferred to sticky thermoset polymers such as epoxy resin using Ni template without any degradation of anti-adhesive property.

AB - Embossing lithography is one of the most promising technologies for mass production of nano-scale structures. To advance the industrialization of embossing lithography, fabrication of low cost, high mechanical strength embossing template is essential. Electroformed Ni template can be used as an embossing template if its poor anti-adhesive property is fixed by proper releasing layer treatment, especially, when it is used with sticky thermoset polymer. In this experiment, quartz master template with 200nm to 2um sized surface protrusions was fabricated and used to emboss the PMMA coated Si wafer. Then the embossed PMMA layer was coated with metal seed layer (Ni) and electroplating of Ni was followed to fabricate Ni template. To apply anti-stiction SAM layer, SiO2 and Si layer was coated on Ni template. With proper anti-stiction treatment of Ni template, sub-micron patterns were successfully transferred to sticky thermoset polymers such as epoxy resin using Ni template without any degradation of anti-adhesive property.

KW - Anti-adhesive layer

KW - Electroforming

KW - Embossing lithography

KW - Epoxy resin

KW - Nickel template

KW - SAM coating

KW - Thermoset polymer

UR - http://www.scopus.com/inward/record.url?scp=34247558463&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=34247558463&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:34247558463

SN - 3908451310

SN - 9783908451310

VL - 124-126

T3 - Diffusion and Defect Data Pt.B: Solid State Phenomena

SP - 147

EP - 151

BT - Diffusion and Defect Data Pt.B: Solid State Phenomena

ER -