TY - GEN
T1 - Embossing lithography on sticky thermost polymer using Ni template
AU - Byeon, Kyeongjae
AU - Hong, Sunghoon
AU - Yang, Kiyeon
AU - Ra, Seunghyun
AU - Ahn, Jinho
AU - Lee, Heon
PY - 2007
Y1 - 2007
N2 - Embossing lithography is one of the most promising technologies for mass production of nano-scale structures. To advance the industrialization of embossing lithography, fabrication of low cost, high mechanical strength embossing template is essential. Electroformed Ni template can be used as an embossing template if its poor anti-adhesive property is fixed by proper releasing layer treatment, especially, when it is used with sticky thermoset polymer. In this experiment, quartz master template with 200nm to 2um sized surface protrusions was fabricated and used to emboss the PMMA coated Si wafer. Then the embossed PMMA layer was coated with metal seed layer (Ni) and electroplating of Ni was followed to fabricate Ni template. To apply anti-stiction SAM layer, SiO2 and Si layer was coated on Ni template. With proper anti-stiction treatment of Ni template, sub-micron patterns were successfully transferred to sticky thermoset polymers such as epoxy resin using Ni template without any degradation of anti-adhesive property.
AB - Embossing lithography is one of the most promising technologies for mass production of nano-scale structures. To advance the industrialization of embossing lithography, fabrication of low cost, high mechanical strength embossing template is essential. Electroformed Ni template can be used as an embossing template if its poor anti-adhesive property is fixed by proper releasing layer treatment, especially, when it is used with sticky thermoset polymer. In this experiment, quartz master template with 200nm to 2um sized surface protrusions was fabricated and used to emboss the PMMA coated Si wafer. Then the embossed PMMA layer was coated with metal seed layer (Ni) and electroplating of Ni was followed to fabricate Ni template. To apply anti-stiction SAM layer, SiO2 and Si layer was coated on Ni template. With proper anti-stiction treatment of Ni template, sub-micron patterns were successfully transferred to sticky thermoset polymers such as epoxy resin using Ni template without any degradation of anti-adhesive property.
KW - Anti-adhesive layer
KW - Electroforming
KW - Embossing lithography
KW - Epoxy resin
KW - Nickel template
KW - SAM coating
KW - Thermoset polymer
UR - http://www.scopus.com/inward/record.url?scp=34247558463&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=34247558463&partnerID=8YFLogxK
U2 - 10.4028/3-908451-31-0.147
DO - 10.4028/3-908451-31-0.147
M3 - Conference contribution
AN - SCOPUS:34247558463
SN - 3908451310
SN - 9783908451310
T3 - Solid State Phenomena
SP - 147
EP - 151
BT - Advances in Nanomaterials and Processing - IUMRS - ICA - 2006 International Conference in Asia
PB - Trans Tech Publications Ltd
T2 - IUMRS International Conference in Asia 2006, IUMRS-ICA 2006
Y2 - 10 September 2006 through 14 September 2006
ER -