Embossing lithography on sticky thermost polymer using Ni template

Kyeongjae Byeon; Sunghoon Hong; Kiyeon Yang; Seunghyun Ra; Jinho Ahn; Heon Lee

doi:10.4028/3-908451-31-0.147

Embossing lithography on sticky thermost polymer using Ni template

Kyeongjae Byeon, Sunghoon Hong, Kiyeon Yang, Seunghyun Ra, Jinho Ahn, Heon Lee

Department of Materials Science and Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Citations (Scopus)

Abstract

Embossing lithography is one of the most promising technologies for mass production of nano-scale structures. To advance the industrialization of embossing lithography, fabrication of low cost, high mechanical strength embossing template is essential. Electroformed Ni template can be used as an embossing template if its poor anti-adhesive property is fixed by proper releasing layer treatment, especially, when it is used with sticky thermoset polymer. In this experiment, quartz master template with 200nm to 2um sized surface protrusions was fabricated and used to emboss the PMMA coated Si wafer. Then the embossed PMMA layer was coated with metal seed layer (Ni) and electroplating of Ni was followed to fabricate Ni template. To apply anti-stiction SAM layer, SiO₂ and Si layer was coated on Ni template. With proper anti-stiction treatment of Ni template, sub-micron patterns were successfully transferred to sticky thermoset polymers such as epoxy resin using Ni template without any degradation of anti-adhesive property.

Original language	English
Title of host publication	Advances in Nanomaterials and Processing - IUMRS - ICA - 2006 International Conference in Asia
Publisher	Trans Tech Publications Ltd
Pages	147-151
Number of pages	5
Edition	PART 1
ISBN (Print)	3908451310, 9783908451310
DOIs	https://doi.org/10.4028/3-908451-31-0.147
Publication status	Published - 2007
Event	IUMRS International Conference in Asia 2006, IUMRS-ICA 2006 - Jeju, Korea, Republic of Duration: 2006 Sep 10 → 2006 Sep 14

Publication series

Name	Solid State Phenomena
Number	PART 1
Volume	124-126
ISSN (Print)	1012-0394

Other

Other	IUMRS International Conference in Asia 2006, IUMRS-ICA 2006
Country	Korea, Republic of
City	Jeju
Period	06/9/10 → 06/9/14

Keywords

Anti-adhesive layer
Electroforming
Embossing lithography
Epoxy resin
Nickel template
SAM coating
Thermoset polymer

ASJC Scopus subject areas

Atomic and Molecular Physics, and Optics
Materials Science(all)
Condensed Matter Physics

Access to Document

10.4028/3-908451-31-0.147

Fingerprint Dive into the research topics of 'Embossing lithography on sticky thermost polymer using Ni template'. Together they form a unique fingerprint.

Cite this

Byeon, K., Hong, S., Yang, K., Ra, S., Ahn, J., & Lee, H. (2007). Embossing lithography on sticky thermost polymer using Ni template. In Advances in Nanomaterials and Processing - IUMRS - ICA - 2006 International Conference in Asia (PART 1 ed., pp. 147-151). (Solid State Phenomena; Vol. 124-126, No. PART 1). Trans Tech Publications Ltd. https://doi.org/10.4028/3-908451-31-0.147

Embossing lithography on sticky thermost polymer using Ni template. / Byeon, Kyeongjae; Hong, Sunghoon; Yang, Kiyeon; Ra, Seunghyun; Ahn, Jinho; Lee, Heon.

Advances in Nanomaterials and Processing - IUMRS - ICA - 2006 International Conference in Asia. PART 1. ed. Trans Tech Publications Ltd, 2007. p. 147-151 (Solid State Phenomena; Vol. 124-126, No. PART 1).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Byeon, K, Hong, S, Yang, K, Ra, S, Ahn, J & Lee, H 2007, Embossing lithography on sticky thermost polymer using Ni template. in Advances in Nanomaterials and Processing - IUMRS - ICA - 2006 International Conference in Asia. PART 1 edn, Solid State Phenomena, no. PART 1, vol. 124-126, Trans Tech Publications Ltd, pp. 147-151, IUMRS International Conference in Asia 2006, IUMRS-ICA 2006, Jeju, Korea, Republic of, 06/9/10. https://doi.org/10.4028/3-908451-31-0.147

@inproceedings{184e121ae5784c03bc6c89618c759897,

title = "Embossing lithography on sticky thermost polymer using Ni template",

abstract = "Embossing lithography is one of the most promising technologies for mass production of nano-scale structures. To advance the industrialization of embossing lithography, fabrication of low cost, high mechanical strength embossing template is essential. Electroformed Ni template can be used as an embossing template if its poor anti-adhesive property is fixed by proper releasing layer treatment, especially, when it is used with sticky thermoset polymer. In this experiment, quartz master template with 200nm to 2um sized surface protrusions was fabricated and used to emboss the PMMA coated Si wafer. Then the embossed PMMA layer was coated with metal seed layer (Ni) and electroplating of Ni was followed to fabricate Ni template. To apply anti-stiction SAM layer, SiO2 and Si layer was coated on Ni template. With proper anti-stiction treatment of Ni template, sub-micron patterns were successfully transferred to sticky thermoset polymers such as epoxy resin using Ni template without any degradation of anti-adhesive property.",

keywords = "Anti-adhesive layer, Electroforming, Embossing lithography, Epoxy resin, Nickel template, SAM coating, Thermoset polymer",

author = "Kyeongjae Byeon and Sunghoon Hong and Kiyeon Yang and Seunghyun Ra and Jinho Ahn and Heon Lee",

year = "2007",

doi = "10.4028/3-908451-31-0.147",

language = "English",

isbn = "3908451310",

series = "Solid State Phenomena",

publisher = "Trans Tech Publications Ltd",

number = "PART 1",

pages = "147--151",

booktitle = "Advances in Nanomaterials and Processing - IUMRS - ICA - 2006 International Conference in Asia",

edition = "PART 1",

note = "IUMRS International Conference in Asia 2006, IUMRS-ICA 2006 ; Conference date: 10-09-2006 Through 14-09-2006",

}

TY - GEN

T1 - Embossing lithography on sticky thermost polymer using Ni template

AU - Byeon, Kyeongjae

AU - Hong, Sunghoon

AU - Yang, Kiyeon

AU - Ra, Seunghyun

AU - Ahn, Jinho

AU - Lee, Heon

PY - 2007

Y1 - 2007

N2 - Embossing lithography is one of the most promising technologies for mass production of nano-scale structures. To advance the industrialization of embossing lithography, fabrication of low cost, high mechanical strength embossing template is essential. Electroformed Ni template can be used as an embossing template if its poor anti-adhesive property is fixed by proper releasing layer treatment, especially, when it is used with sticky thermoset polymer. In this experiment, quartz master template with 200nm to 2um sized surface protrusions was fabricated and used to emboss the PMMA coated Si wafer. Then the embossed PMMA layer was coated with metal seed layer (Ni) and electroplating of Ni was followed to fabricate Ni template. To apply anti-stiction SAM layer, SiO2 and Si layer was coated on Ni template. With proper anti-stiction treatment of Ni template, sub-micron patterns were successfully transferred to sticky thermoset polymers such as epoxy resin using Ni template without any degradation of anti-adhesive property.

AB - Embossing lithography is one of the most promising technologies for mass production of nano-scale structures. To advance the industrialization of embossing lithography, fabrication of low cost, high mechanical strength embossing template is essential. Electroformed Ni template can be used as an embossing template if its poor anti-adhesive property is fixed by proper releasing layer treatment, especially, when it is used with sticky thermoset polymer. In this experiment, quartz master template with 200nm to 2um sized surface protrusions was fabricated and used to emboss the PMMA coated Si wafer. Then the embossed PMMA layer was coated with metal seed layer (Ni) and electroplating of Ni was followed to fabricate Ni template. To apply anti-stiction SAM layer, SiO2 and Si layer was coated on Ni template. With proper anti-stiction treatment of Ni template, sub-micron patterns were successfully transferred to sticky thermoset polymers such as epoxy resin using Ni template without any degradation of anti-adhesive property.

KW - Anti-adhesive layer

KW - Electroforming

KW - Embossing lithography

KW - Epoxy resin

KW - Nickel template

KW - SAM coating

KW - Thermoset polymer

UR - http://www.scopus.com/inward/record.url?scp=34247558463&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=34247558463&partnerID=8YFLogxK

U2 - 10.4028/3-908451-31-0.147

DO - 10.4028/3-908451-31-0.147

M3 - Conference contribution

AN - SCOPUS:34247558463

SN - 3908451310

SN - 9783908451310

T3 - Solid State Phenomena

SP - 147

EP - 151

BT - Advances in Nanomaterials and Processing - IUMRS - ICA - 2006 International Conference in Asia

PB - Trans Tech Publications Ltd

T2 - IUMRS International Conference in Asia 2006, IUMRS-ICA 2006

Y2 - 10 September 2006 through 14 September 2006

ER -