Embossing on epoxy thermoset polymer using SiO2 coated nickel template

Kyeong Jae Byeon, Sung Hoon Hong, Ki Yeon Yang, Deok Kee Kim, Heon Lee

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

Embossing or imprint lithography is the key-technology for the mass production of nanosized structures with low cost. Currently Si or quartz template which is produced by e-beam or DUV lithography and reactive ion etching, is used. However they are very expensive and easily damaged due to their brittleness. On the other hand, Ni template has high mechanical durability and can be fabricated with low cost by electroplating. However, one of the key obstacles of Ni template is poor antistiction property, when it is used with sticky thermoset polymer. Due to its poor antistiction property, detachment of Ni template from epoxy substrate is one of the key obstacles. In this experiment, quartz template with 150nm to 1μm sized surface protrusion was fabricated and used to emboss the PMMA coated Si wafer. Then the imprinted PMMA layer was coated with metal seed layer and electroplating of Ni was followed to fabricate Ni template with 150nm to 1μm sized patterns. In order to form antistiction layer on Ni template, SAM antistiction layer was formed on SiO 2 coated Ni template. As a result, nano patterns could be successfully transferred to sticky thermoset polymer using Ni template without any degradation of antistiction property.

Original languageEnglish
Title of host publicationSupplement to THERMEC 2006, 5th International Conference on PROCESSING and MANUFACTURING OF ADVANCED MATERIALS, THERMEC 2006
PublisherTrans Tech Publications Ltd
Pages968-973
Number of pages6
EditionPART 1
ISBN (Print)0878494286, 9780878494286
DOIs
Publication statusPublished - 2007
Event5th International Conference on Processing and Manufacturing of Advanced Materials - THERMEC'2006 - Vancouver, Canada
Duration: 2006 Jul 42006 Jul 8

Publication series

NameMaterials Science Forum
NumberPART 1
Volume539-543
ISSN (Print)0255-5476
ISSN (Electronic)1662-9752

Other

Other5th International Conference on Processing and Manufacturing of Advanced Materials - THERMEC'2006
CountryCanada
CityVancouver
Period06/7/406/7/8

Keywords

  • Embossing lithography
  • Epoxy resin
  • Ni template
  • SAM coating
  • Thermoset polymer

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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  • Cite this

    Byeon, K. J., Hong, S. H., Yang, K. Y., Kim, D. K., & Lee, H. (2007). Embossing on epoxy thermoset polymer using SiO2 coated nickel template. In Supplement to THERMEC 2006, 5th International Conference on PROCESSING and MANUFACTURING OF ADVANCED MATERIALS, THERMEC 2006 (PART 1 ed., pp. 968-973). (Materials Science Forum; Vol. 539-543, No. PART 1). Trans Tech Publications Ltd. https://doi.org/10.4028/0-87849-428-6.968