Encapsulated flexible organic light-emitting diodes: Progress toward a simple and cost effective contact printing technique

Hakkoo Kim, Eun Ho Song, Kyung Bok Choi, Ju Hyun Hwang, Young Wook Park, Byeong Kwon Ju

Research output: Contribution to journalArticlepeer-review

Abstract

We present a new methodology for encapsulation of flexible organic electronics that involves no electrochemical reactions. In this study, the encapsulation is formed using a simple, vacuum damage-free and rapid process utilizing a UV-curable resin. The fabricated device has superior reproducibility and uniformity, which makes it suitable for industrial mass production.

Original languageEnglish
Pages (from-to)1137-1139
Number of pages3
JournalDigest of Technical Papers - SID International Symposium
Volume44
Issue number1
DOIs
Publication statusPublished - 2013 Jun

Keywords

  • Contact printing
  • Encapsulation
  • Flexible organic light-emitting diodes (FOLED)
  • Solvent damage-free

ASJC Scopus subject areas

  • Engineering(all)

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