We present a new methodology for encapsulation of flexible organic electronics that involves no electrochemical reactions. In this study, the encapsulation is formed using a simple, vacuum damage-free and rapid process utilizing a UV-curable resin. The fabricated device has superior reproducibility and uniformity, which makes it suitable for industrial mass production.
|Number of pages||3|
|Journal||Digest of Technical Papers - SID International Symposium|
|Publication status||Published - 2013 Jun|
- Contact printing
- Flexible organic light-emitting diodes (FOLED)
- Solvent damage-free
ASJC Scopus subject areas