Encapsulated flexible organic light-emitting diodes: Progress toward a simple and cost effective contact printing technique

Hakkoo Kim, Eun Ho Song, Kyung Bok Choi, Ju Hyun Hwang, Young Wook Park, Byeong Kwon Ju

Research output: Chapter in Book/Report/Conference proceedingChapter

Abstract

We present a new methodology for encapsulation of flexible organic electronics that involves no electrochemical reactions. In this study, the encapsulation is formed using a simple, vacuum damage-free and rapid process utilizing a UV-curable resin. The fabricated device has superior reproducibility and uniformity, which makes it suitable for industrial mass production.

Original languageEnglish
Title of host publicationDigest of Technical Papers - SID International Symposium
PublisherBlackwell Publishing Ltd
Pages1137-1139
Number of pages3
Volume44
Edition1
DOIs
Publication statusPublished - 2013

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Keywords

  • Contact printing
  • Encapsulation
  • Flexible organic light-emitting diodes (FOLED)
  • Solvent damage-free

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Kim, H., Song, E. H., Choi, K. B., Hwang, J. H., Park, Y. W., & Ju, B. K. (2013). Encapsulated flexible organic light-emitting diodes: Progress toward a simple and cost effective contact printing technique. In Digest of Technical Papers - SID International Symposium (1 ed., Vol. 44, pp. 1137-1139). Blackwell Publishing Ltd. https://doi.org/10.1002/j.2168-0159.2013.tb06427.x