Abstract
Existing thermal management systems for microprocessors assume that the thermal resistance of the heat-sink is constant and that the objective of the cooling system is simply to avoid thermal emergencies. But in fact the thermal resistance of the usual forced-convection heat-sink is inversely proportional to the fan speed, and a more rational objective is to minimize the total power consumption of both processor and cooling system. Our new method of dynamic thermal management uses both the fan speed and the voltage/frequency of the microprocessor as control variables. Experiments show that tracking the energy-optimal steady-state temperature can saves up to 17.6% of the overall energy, when compared with a conventional approach that merely avoids over-heating.
| Original language | English |
|---|---|
| Title of host publication | IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD |
| Pages | 652-657 |
| Number of pages | 6 |
| Publication status | Published - 2009 Dec 1 |
| Event | 2009 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2009 - San Jose, CA, United States Duration: 2009 Nov 2 → 2009 Nov 5 |
Other
| Other | 2009 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2009 |
|---|---|
| Country | United States |
| City | San Jose, CA |
| Period | 09/11/2 → 09/11/5 |
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ASJC Scopus subject areas
- Computer Graphics and Computer-Aided Design
- Computer Science Applications
- Software
Cite this
Energy-optimal dynamic thermal management for green computing. / Shin, Donghwa; Kim, Jihun; Chang, Naehyuck; Choi, Jinhang; Jung, Sung Woo; Chung, Eui Young.
IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD. 2009. p. 652-657 5361225.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Energy-optimal dynamic thermal management for green computing
AU - Shin, Donghwa
AU - Kim, Jihun
AU - Chang, Naehyuck
AU - Choi, Jinhang
AU - Jung, Sung Woo
AU - Chung, Eui Young
PY - 2009/12/1
Y1 - 2009/12/1
N2 - Existing thermal management systems for microprocessors assume that the thermal resistance of the heat-sink is constant and that the objective of the cooling system is simply to avoid thermal emergencies. But in fact the thermal resistance of the usual forced-convection heat-sink is inversely proportional to the fan speed, and a more rational objective is to minimize the total power consumption of both processor and cooling system. Our new method of dynamic thermal management uses both the fan speed and the voltage/frequency of the microprocessor as control variables. Experiments show that tracking the energy-optimal steady-state temperature can saves up to 17.6% of the overall energy, when compared with a conventional approach that merely avoids over-heating.
AB - Existing thermal management systems for microprocessors assume that the thermal resistance of the heat-sink is constant and that the objective of the cooling system is simply to avoid thermal emergencies. But in fact the thermal resistance of the usual forced-convection heat-sink is inversely proportional to the fan speed, and a more rational objective is to minimize the total power consumption of both processor and cooling system. Our new method of dynamic thermal management uses both the fan speed and the voltage/frequency of the microprocessor as control variables. Experiments show that tracking the energy-optimal steady-state temperature can saves up to 17.6% of the overall energy, when compared with a conventional approach that merely avoids over-heating.
UR - http://www.scopus.com/inward/record.url?scp=76349124864&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=76349124864&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:76349124864
SN - 9781605588001
SP - 652
EP - 657
BT - IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD
ER -