Abstract
Existing thermal management systems for microprocessors assume that the thermal resistance of the heat-sink is constant and that the objective of the cooling system is simply to avoid thermal emergencies. But in fact the thermal resistance of the usual forced-convection heat-sink is inversely proportional to the fan speed, and a more rational objective is to minimize the total power consumption of both processor and cooling system. Our new method of dynamic thermal management uses both the fan speed and the voltage/frequency of the microprocessor as control variables. Experiments show that tracking the energy-optimal steady-state temperature can saves up to 17.6% of the overall energy, when compared with a conventional approach that merely avoids over-heating.
| Original language | English |
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| Title of host publication | IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD |
| Pages | 652-657 |
| Number of pages | 6 |
| Publication status | Published - 2009 Dec 1 |
| Event | 2009 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2009 - San Jose, CA, United States Duration: 2009 Nov 2 → 2009 Nov 5 |
Other
| Other | 2009 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2009 |
|---|---|
| Country | United States |
| City | San Jose, CA |
| Period | 09/11/2 → 09/11/5 |
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ASJC Scopus subject areas
- Computer Graphics and Computer-Aided Design
- Computer Science Applications
- Software