TY - GEN
T1 - Energy-optimal dynamic thermal management for green computing
AU - Shin, Donghwa
AU - Kim, Jihun
AU - Chang, Naehyuck
AU - Choi, Jinhang
AU - Chung, Sung Woo
AU - Chung, Eui Young
PY - 2009
Y1 - 2009
N2 - Existing thermal management systems for microprocessors assume that the thermal resistance of the heat-sink is constant and that the objective of the cooling system is simply to avoid thermal emergencies. But in fact the thermal resistance of the usual forced-convection heat-sink is inversely proportional to the fan speed, and a more rational objective is to minimize the total power consumption of both processor and cooling system. Our new method of dynamic thermal management uses both the fan speed and the voltage/frequency of the microprocessor as control variables. Experiments show that tracking the energy-optimal steady-state temperature can saves up to 17.6% of the overall energy, when compared with a conventional approach that merely avoids over-heating.
AB - Existing thermal management systems for microprocessors assume that the thermal resistance of the heat-sink is constant and that the objective of the cooling system is simply to avoid thermal emergencies. But in fact the thermal resistance of the usual forced-convection heat-sink is inversely proportional to the fan speed, and a more rational objective is to minimize the total power consumption of both processor and cooling system. Our new method of dynamic thermal management uses both the fan speed and the voltage/frequency of the microprocessor as control variables. Experiments show that tracking the energy-optimal steady-state temperature can saves up to 17.6% of the overall energy, when compared with a conventional approach that merely avoids over-heating.
UR - http://www.scopus.com/inward/record.url?scp=76349124864&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=76349124864&partnerID=8YFLogxK
U2 - 10.1145/1687399.1687520
DO - 10.1145/1687399.1687520
M3 - Conference contribution
AN - SCOPUS:76349124864
SN - 9781605588001
T3 - IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD
SP - 652
EP - 657
BT - Proceedings of the 2009 IEEE/ACM International Conference on Computer-Aided Design - Digest of Technical Papers, ICCAD 2009
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2009 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2009
Y2 - 2 November 2009 through 5 November 2009
ER -