Enhanced adhesion with pedestal-shaped elastomeric stamps for transfer printing

Seok Kim, Andrew Carlson, Huanyu Cheng, Seungwoo Lee, Jung Ki Park, Yonggang Huang, John A. Rogers

Research output: Contribution to journalArticle

37 Citations (Scopus)

Abstract

Microscale elastomeric relief structures with "pedestal" shapes provide enhanced operation in stamps designed for deterministic materials assembly via transfer printing. Experimental measurements of adhesion and finite element analysis both show that for certain geometries, exceptionally large enhancements in adhesion strength (over 15×) can be achieved. Transfer printing of microscale platelets of silicon and ultrathin gallium nitride light emitting diodes onto a silicon substrate without adhesive coatings demonstrates some capabilities in assembly that result from this type of stamp, of interest in diverse applications, including those that involve heterogeneous materials integration.

Original languageEnglish
Article number171909
JournalApplied Physics Letters
Volume100
Issue number17
DOIs
Publication statusPublished - 2012 Apr 23

ASJC Scopus subject areas

  • Physics and Astronomy (miscellaneous)

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    Kim, S., Carlson, A., Cheng, H., Lee, S., Park, J. K., Huang, Y., & Rogers, J. A. (2012). Enhanced adhesion with pedestal-shaped elastomeric stamps for transfer printing. Applied Physics Letters, 100(17), [171909]. https://doi.org/10.1063/1.4706257