Enhanced current transport and injection in thin-film gallium-nitride light-emitting diodes by laser-based doping

Su Jin Kim, Kyeong Heon Kim, Ho Young Chung, Hee Woong Shin, Byeong Ryong Lee, Tak Jeong, Hyung Jo Park, Tae Geun Kim

Research output: Contribution to journalArticle

Abstract

This paper reports improvements in the electrical and optical properties of blue-emission gallium nitride (GaN)-based thin-film light-emitting diodes (TFLEDs) after laser-based Si doping (LBSD) of a nitrogen-face n-GaN (denoted as hereafter n-GaN) layer. Experimental results show that the light-output powers of the flat- and rough-surface TFLEDs after LBSD are 52.1 and 11.35% higher than those before LBSD, respectively, at a current of 350 mA, while the corresponding operating voltages are decreased by 0.22 and 0.28 V for the flat- and rough-surface TFLEDs after LBSD, respectively. The reduced operating voltage after LBSD of the top n-GaN layer may result from the remarkably decreased specific contact resistance at the metal/n-GaN interface and the low series resistance of the TFLED device. The LBSD of n-GaN increases the number of nitrogen vacancies, and Si substitutes for Ga (SiGa) at the metal/n-GaN interface to produce highly Si-doped regions in n-GaN, leading to a decrease in the Schottky barrier height and width. As a result, the specific contact resistances are significantly decreased to 1.56 10-5 and 2.86 10-5 I cm2 for the flat- and rough-surface samples after LBSD, respectively. On the other hand, the increased light-output power after LBSD can be explained by the uniform current spreading, efficient current injection, and enhanced light scattering resulting from the low contact resistivity, low lateral current resistance, and additional textured surface, respectively. Furthermore, LBSD did not degrade the electrical properties of the TFLEDs owing to low reverse leakage currents. The results indicate that our approach could potentially enable high-efficiency and high-power capabilities for optoelectronic devices.

Original languageEnglish
Pages (from-to)16601-16609
Number of pages9
JournalACS Applied Materials and Interfaces
Volume6
Issue number19
DOIs
Publication statusPublished - 2014 Jan 1

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Gallium nitride
Light emitting diodes
Doping (additives)
Thin films
Lasers
Contact resistance
Electric properties
Nitrogen
Metals
gallium nitride
Electric potential
Leakage currents
Light scattering
Optoelectronic devices
Vacancies
Optical properties

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Enhanced current transport and injection in thin-film gallium-nitride light-emitting diodes by laser-based doping. / Kim, Su Jin; Kim, Kyeong Heon; Chung, Ho Young; Shin, Hee Woong; Lee, Byeong Ryong; Jeong, Tak; Park, Hyung Jo; Kim, Tae Geun.

In: ACS Applied Materials and Interfaces, Vol. 6, No. 19, 01.01.2014, p. 16601-16609.

Research output: Contribution to journalArticle

Kim, Su Jin ; Kim, Kyeong Heon ; Chung, Ho Young ; Shin, Hee Woong ; Lee, Byeong Ryong ; Jeong, Tak ; Park, Hyung Jo ; Kim, Tae Geun. / Enhanced current transport and injection in thin-film gallium-nitride light-emitting diodes by laser-based doping. In: ACS Applied Materials and Interfaces. 2014 ; Vol. 6, No. 19. pp. 16601-16609.
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abstract = "This paper reports improvements in the electrical and optical properties of blue-emission gallium nitride (GaN)-based thin-film light-emitting diodes (TFLEDs) after laser-based Si doping (LBSD) of a nitrogen-face n-GaN (denoted as hereafter n-GaN) layer. Experimental results show that the light-output powers of the flat- and rough-surface TFLEDs after LBSD are 52.1 and 11.35{\%} higher than those before LBSD, respectively, at a current of 350 mA, while the corresponding operating voltages are decreased by 0.22 and 0.28 V for the flat- and rough-surface TFLEDs after LBSD, respectively. The reduced operating voltage after LBSD of the top n-GaN layer may result from the remarkably decreased specific contact resistance at the metal/n-GaN interface and the low series resistance of the TFLED device. The LBSD of n-GaN increases the number of nitrogen vacancies, and Si substitutes for Ga (SiGa) at the metal/n-GaN interface to produce highly Si-doped regions in n-GaN, leading to a decrease in the Schottky barrier height and width. As a result, the specific contact resistances are significantly decreased to 1.56 10-5 and 2.86 10-5 I cm2 for the flat- and rough-surface samples after LBSD, respectively. On the other hand, the increased light-output power after LBSD can be explained by the uniform current spreading, efficient current injection, and enhanced light scattering resulting from the low contact resistivity, low lateral current resistance, and additional textured surface, respectively. Furthermore, LBSD did not degrade the electrical properties of the TFLEDs owing to low reverse leakage currents. The results indicate that our approach could potentially enable high-efficiency and high-power capabilities for optoelectronic devices.",
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T1 - Enhanced current transport and injection in thin-film gallium-nitride light-emitting diodes by laser-based doping

AU - Kim, Su Jin

AU - Kim, Kyeong Heon

AU - Chung, Ho Young

AU - Shin, Hee Woong

AU - Lee, Byeong Ryong

AU - Jeong, Tak

AU - Park, Hyung Jo

AU - Kim, Tae Geun

PY - 2014/1/1

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N2 - This paper reports improvements in the electrical and optical properties of blue-emission gallium nitride (GaN)-based thin-film light-emitting diodes (TFLEDs) after laser-based Si doping (LBSD) of a nitrogen-face n-GaN (denoted as hereafter n-GaN) layer. Experimental results show that the light-output powers of the flat- and rough-surface TFLEDs after LBSD are 52.1 and 11.35% higher than those before LBSD, respectively, at a current of 350 mA, while the corresponding operating voltages are decreased by 0.22 and 0.28 V for the flat- and rough-surface TFLEDs after LBSD, respectively. The reduced operating voltage after LBSD of the top n-GaN layer may result from the remarkably decreased specific contact resistance at the metal/n-GaN interface and the low series resistance of the TFLED device. The LBSD of n-GaN increases the number of nitrogen vacancies, and Si substitutes for Ga (SiGa) at the metal/n-GaN interface to produce highly Si-doped regions in n-GaN, leading to a decrease in the Schottky barrier height and width. As a result, the specific contact resistances are significantly decreased to 1.56 10-5 and 2.86 10-5 I cm2 for the flat- and rough-surface samples after LBSD, respectively. On the other hand, the increased light-output power after LBSD can be explained by the uniform current spreading, efficient current injection, and enhanced light scattering resulting from the low contact resistivity, low lateral current resistance, and additional textured surface, respectively. Furthermore, LBSD did not degrade the electrical properties of the TFLEDs owing to low reverse leakage currents. The results indicate that our approach could potentially enable high-efficiency and high-power capabilities for optoelectronic devices.

AB - This paper reports improvements in the electrical and optical properties of blue-emission gallium nitride (GaN)-based thin-film light-emitting diodes (TFLEDs) after laser-based Si doping (LBSD) of a nitrogen-face n-GaN (denoted as hereafter n-GaN) layer. Experimental results show that the light-output powers of the flat- and rough-surface TFLEDs after LBSD are 52.1 and 11.35% higher than those before LBSD, respectively, at a current of 350 mA, while the corresponding operating voltages are decreased by 0.22 and 0.28 V for the flat- and rough-surface TFLEDs after LBSD, respectively. The reduced operating voltage after LBSD of the top n-GaN layer may result from the remarkably decreased specific contact resistance at the metal/n-GaN interface and the low series resistance of the TFLED device. The LBSD of n-GaN increases the number of nitrogen vacancies, and Si substitutes for Ga (SiGa) at the metal/n-GaN interface to produce highly Si-doped regions in n-GaN, leading to a decrease in the Schottky barrier height and width. As a result, the specific contact resistances are significantly decreased to 1.56 10-5 and 2.86 10-5 I cm2 for the flat- and rough-surface samples after LBSD, respectively. On the other hand, the increased light-output power after LBSD can be explained by the uniform current spreading, efficient current injection, and enhanced light scattering resulting from the low contact resistivity, low lateral current resistance, and additional textured surface, respectively. Furthermore, LBSD did not degrade the electrical properties of the TFLEDs owing to low reverse leakage currents. The results indicate that our approach could potentially enable high-efficiency and high-power capabilities for optoelectronic devices.

KW - GaN

KW - laser

KW - LEDs

KW - Si doping

KW - thin film

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