Enhanced growth kinetics of intermetallic compounds between bicontaining Sn-3.5Ag solders and Cu substrate during aging

Soon Tae Kim, Joo Youl Huh

Research output: Contribution to journalArticle

Abstract

The effect of adding Bi to a eutectic Sn-3.5Ag solder alloy on the growth kinetics of the intermetallic compounds (IMCs) in solder/Cu joints was examined at the aging temperatures of 130°C, 150°C and 180°C. At 150°C and 180°C, the growth rate of the Cu6Sn5 layer was significantly enhanced, but that of the Cu3Sn layer was rather reduced with increasing Bi content up to 12 wt.%. At 130°C, however, both the η and ε layers appeared to grow faster as the Bi content in the solder was increased to 12 wt.%. These results suggest that the accumulation of Bi ahead of the Cu6Sn5 layers can affect not only the interfacial reaction barrier but also the local thermodynamics at the interface between the Cu6Sn5 layer and the solder.

Original languageEnglish
Pages (from-to)2627-2630
Number of pages4
JournalMaterials Science Forum
Volume475-479
Issue numberIV
Publication statusPublished - 2005 Apr 25

Fingerprint

Growth kinetics
solders
Soldering alloys
Intermetallics
intermetallics
Aging of materials
kinetics
Substrates
Surface chemistry
Eutectics
eutectics
Thermodynamics
thermodynamics
Temperature
temperature

Keywords

  • Growth kinetics
  • Intermetallic compounds
  • Sn-Ag-Bi solder

ASJC Scopus subject areas

  • Materials Science(all)

Cite this

Enhanced growth kinetics of intermetallic compounds between bicontaining Sn-3.5Ag solders and Cu substrate during aging. / Kim, Soon Tae; Huh, Joo Youl.

In: Materials Science Forum, Vol. 475-479, No. IV, 25.04.2005, p. 2627-2630.

Research output: Contribution to journalArticle

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