Enhanced thermal conductivity and viscosity of copper nanoparticles in ethylene glycol nanofluid

J. Garg, B. Poudel, M. Chiesa, J. B. Gordon, J. J. Ma, J. B. Wang, Z. F. Ren, Yong Tae Kang, H. Ohtani, J. Nanda, G. H. McKinley, G. Chen

Research output: Contribution to journalArticle

277 Citations (Scopus)

Abstract

This study investigates the thermal conductivity and viscosity of copper nanoparticles in ethylene glycol. The nanofluid was prepared by synthesizing copper nanoparticles using a chemical reduction method, with water as the solvent, and then dispersing them in ethylene glycol using a sonicator. Volume loadings of up to 2% were prepared. The measured increase in thermal conductivity was twice the value predicted by the Maxwell effective medium theory. The increase in viscosity was about four times of that predicted by the Einstein law of viscosity. Analytical calculations suggest that this nanofluid would not be beneficial as a coolant in heat exchangers without changing the tube diameter. However, increasing the tube diameter to exploit the increased thermal conductivity of the nanofluid can lead to better thermal performance.

Original languageEnglish
Article number074301
JournalJournal of Applied Physics
Volume103
Issue number7
DOIs
Publication statusPublished - 2008 Apr 21
Externally publishedYes

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glycols
ethylene
thermal conductivity
viscosity
copper
nanoparticles
tubes
dispersing
coolants
heat exchangers
water

ASJC Scopus subject areas

  • Physics and Astronomy (miscellaneous)
  • Physics and Astronomy(all)

Cite this

Garg, J., Poudel, B., Chiesa, M., Gordon, J. B., Ma, J. J., Wang, J. B., ... Chen, G. (2008). Enhanced thermal conductivity and viscosity of copper nanoparticles in ethylene glycol nanofluid. Journal of Applied Physics, 103(7), [074301]. https://doi.org/10.1063/1.2902483

Enhanced thermal conductivity and viscosity of copper nanoparticles in ethylene glycol nanofluid. / Garg, J.; Poudel, B.; Chiesa, M.; Gordon, J. B.; Ma, J. J.; Wang, J. B.; Ren, Z. F.; Kang, Yong Tae; Ohtani, H.; Nanda, J.; McKinley, G. H.; Chen, G.

In: Journal of Applied Physics, Vol. 103, No. 7, 074301, 21.04.2008.

Research output: Contribution to journalArticle

Garg, J, Poudel, B, Chiesa, M, Gordon, JB, Ma, JJ, Wang, JB, Ren, ZF, Kang, YT, Ohtani, H, Nanda, J, McKinley, GH & Chen, G 2008, 'Enhanced thermal conductivity and viscosity of copper nanoparticles in ethylene glycol nanofluid', Journal of Applied Physics, vol. 103, no. 7, 074301. https://doi.org/10.1063/1.2902483
Garg, J. ; Poudel, B. ; Chiesa, M. ; Gordon, J. B. ; Ma, J. J. ; Wang, J. B. ; Ren, Z. F. ; Kang, Yong Tae ; Ohtani, H. ; Nanda, J. ; McKinley, G. H. ; Chen, G. / Enhanced thermal conductivity and viscosity of copper nanoparticles in ethylene glycol nanofluid. In: Journal of Applied Physics. 2008 ; Vol. 103, No. 7.
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