Erosion behavior of silicon nitride with graded microstructure

Dae-Soon Lim; Jong In Park; Dong Phill Lim; Byung Dong Han; Dong Soo Park

doi:10.4028/0-87849-965-2.416

Erosion behavior of silicon nitride with graded microstructure

Dae-Soon Lim, Jong In Park, Dong Phill Lim, Byung Dong Han, Dong Soo Park

Department of Materials Science and Engineering

Research output: Contribution to journal › Article

Abstract

Silicon nitride has been considered as candidate tribological material due to their excellent mechanical and thermal properties. This study investigated the effect of graded grain size on the erosion behavior of silicon nitride at room and high temperatures. Erosion tests were carried out with a gas blast-type erosion tester at temperatures up to 800°C. Weight loss after impact of SiC particles were measured. The erosion rate varied with temperature and microstructure. Different erosion behavior depending on microstructure were discussed based on SEM observation Auger depth profile of worn surfaces.

Original language	English
Pages (from-to)	416-420
Number of pages	5
Journal	Key Engineering Materials
Volume	287
DOIs	https://doi.org/10.4028/0-87849-965-2.416
Publication status	Published - 2005 Dec 1

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Keywords

Carbothermal reduction
Erosion
Graded microstructure
Oxidation
Silicon nitride

ASJC Scopus subject areas

Ceramics and Composites
Chemical Engineering (miscellaneous)

Cite this

Lim, D-S., Park, J. I., Lim, D. P., Han, B. D., & Park, D. S. (2005). Erosion behavior of silicon nitride with graded microstructure. Key Engineering Materials, 287, 416-420. https://doi.org/10.4028/0-87849-965-2.416

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10.4028/0-87849-965-2.416