Evaluation of Hair and Scalp Condition Based on Microscopy Image Analysis

Hyungjoon Kim, Woogeol Kim, Jeheok Rew, Jisoo Park, Een Jun Hwang, Seungmin Rho

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

Due to the rapid deployment of IT technology, health care service has entered a new era. Some services such as cardiac monitoring are critical for life and have contributed to saving lives. On the other hand, monitoring hair loss is another interesting health care service. Even though it is not critical for life, people tend to pay much attention to their hair condition. Hair loss is one of the major issues related to the hair condition since excessive and uncared hair loss might lead to bald head. Hair care can be done professionally at the hair care shop but it requires much time and cost. Recently, due to inexpensive smart devices, self-diagnosis on the hair condition has become possible. Still, few applications have been developed to evaluate hair condition. In this paper, we propose a new scheme to evaluate the condition of hair and scalp by extracting diverse features from their microscopy image. The features include hair thickness, hair density and scalp blotch. We show the effectiveness of our scheme by extensive experiments on the prototype system.

Original languageEnglish
Title of host publication2017 International Conference on Platform Technology and Service, PlatCon 2017 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781509051403
DOIs
Publication statusPublished - 2017 Mar 20
Event4th International Conference on Platform Technology and Service, PlatCon 2017 - Busan, Korea, Republic of
Duration: 2017 Feb 132017 Feb 15

Other

Other4th International Conference on Platform Technology and Service, PlatCon 2017
CountryKorea, Republic of
CityBusan
Period17/2/1317/2/15

Fingerprint

health care services
Image analysis
Microscopic examination
monitoring
Health care
evaluation
Monitoring
experiment
costs
Costs
Experiments
time

Keywords

  • feature extraction
  • microscopy image analysis
  • scalp analysis

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Computer Science Applications
  • Hardware and Architecture
  • Education

Cite this

Kim, H., Kim, W., Rew, J., Park, J., Hwang, E. J., & Rho, S. (2017). Evaluation of Hair and Scalp Condition Based on Microscopy Image Analysis. In 2017 International Conference on Platform Technology and Service, PlatCon 2017 - Proceedings [7883708] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/PlatCon.2017.7883708

Evaluation of Hair and Scalp Condition Based on Microscopy Image Analysis. / Kim, Hyungjoon; Kim, Woogeol; Rew, Jeheok; Park, Jisoo; Hwang, Een Jun; Rho, Seungmin.

2017 International Conference on Platform Technology and Service, PlatCon 2017 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2017. 7883708.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kim, H, Kim, W, Rew, J, Park, J, Hwang, EJ & Rho, S 2017, Evaluation of Hair and Scalp Condition Based on Microscopy Image Analysis. in 2017 International Conference on Platform Technology and Service, PlatCon 2017 - Proceedings., 7883708, Institute of Electrical and Electronics Engineers Inc., 4th International Conference on Platform Technology and Service, PlatCon 2017, Busan, Korea, Republic of, 17/2/13. https://doi.org/10.1109/PlatCon.2017.7883708
Kim H, Kim W, Rew J, Park J, Hwang EJ, Rho S. Evaluation of Hair and Scalp Condition Based on Microscopy Image Analysis. In 2017 International Conference on Platform Technology and Service, PlatCon 2017 - Proceedings. Institute of Electrical and Electronics Engineers Inc. 2017. 7883708 https://doi.org/10.1109/PlatCon.2017.7883708
Kim, Hyungjoon ; Kim, Woogeol ; Rew, Jeheok ; Park, Jisoo ; Hwang, Een Jun ; Rho, Seungmin. / Evaluation of Hair and Scalp Condition Based on Microscopy Image Analysis. 2017 International Conference on Platform Technology and Service, PlatCon 2017 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2017.
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