Evaluation of linux bonding features

Stefan Aust, Jong Ok Kim, Peter Davis, Akira Yamaguchi, Sadao Obana

Research output: Chapter in Book/Report/Conference proceedingConference contribution

11 Citations (Scopus)

Abstract

The paper contains an evaluation of the current Linux bonding implementation for wired interfaces. The Linux bonding provides methods to aggregate multiple wired interfaces to support load balancing, fault-tolerance and throughput improvement. The intention is to identify the performance of the current Linux bonding implementation and to use the results and assumptions for future discussions about bonding of wireless interfaces. The paper presents details about interface bonding in a RedHat Linux system and discusses measurement results of two bonded LAN interfaces using the round-robin bonding mode.

Original languageEnglish
Title of host publication2006 International Conference on Communication Technology, ICCT '06
DOIs
Publication statusPublished - 2006
Externally publishedYes
Event2006 International Conference on Communication Technology, ICCT '06 - Guilin, China
Duration: 2006 Nov 272006 Nov 30

Publication series

NameInternational Conference on Communication Technology Proceedings, ICCT

Other

Other2006 International Conference on Communication Technology, ICCT '06
CountryChina
CityGuilin
Period06/11/2706/11/30

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Electrical and Electronic Engineering

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  • Cite this

    Aust, S., Kim, J. O., Davis, P., Yamaguchi, A., & Obana, S. (2006). Evaluation of linux bonding features. In 2006 International Conference on Communication Technology, ICCT '06 [4146536] (International Conference on Communication Technology Proceedings, ICCT). https://doi.org/10.1109/ICCT.2006.341935