TY - GEN
T1 - Evaluation of linux bonding features
AU - Aust, Stefan
AU - Kim, Jong Ok
AU - Davis, Peter
AU - Yamaguchi, Akira
AU - Obana, Sadao
PY - 2006
Y1 - 2006
N2 - The paper contains an evaluation of the current Linux bonding implementation for wired interfaces. The Linux bonding provides methods to aggregate multiple wired interfaces to support load balancing, fault-tolerance and throughput improvement. The intention is to identify the performance of the current Linux bonding implementation and to use the results and assumptions for future discussions about bonding of wireless interfaces. The paper presents details about interface bonding in a RedHat Linux system and discusses measurement results of two bonded LAN interfaces using the round-robin bonding mode.
AB - The paper contains an evaluation of the current Linux bonding implementation for wired interfaces. The Linux bonding provides methods to aggregate multiple wired interfaces to support load balancing, fault-tolerance and throughput improvement. The intention is to identify the performance of the current Linux bonding implementation and to use the results and assumptions for future discussions about bonding of wireless interfaces. The paper presents details about interface bonding in a RedHat Linux system and discusses measurement results of two bonded LAN interfaces using the round-robin bonding mode.
UR - http://www.scopus.com/inward/record.url?scp=34547604510&partnerID=8YFLogxK
U2 - 10.1109/ICCT.2006.341935
DO - 10.1109/ICCT.2006.341935
M3 - Conference contribution
AN - SCOPUS:34547604510
SN - 1424408016
SN - 9781424408016
T3 - International Conference on Communication Technology Proceedings, ICCT
BT - 2006 International Conference on Communication Technology, ICCT '06
T2 - 2006 International Conference on Communication Technology, ICCT '06
Y2 - 27 November 2006 through 30 November 2006
ER -