Evaluation of linux bonding features

Stefan Aust, Jong-Ok Kim, Peter Davis, Akira Yamaguchi, Sadao Obana

Research output: Chapter in Book/Report/Conference proceedingConference contribution

9 Citations (Scopus)

Abstract

The paper contains an evaluation of the current Linux bonding implementation for wired interfaces. The Linux bonding provides methods to aggregate multiple wired interfaces to support load balancing, fault-tolerance and throughput improvement. The intention is to identify the performance of the current Linux bonding implementation and to use the results and assumptions for future discussions about bonding of wireless interfaces. The paper presents details about interface bonding in a RedHat Linux system and discusses measurement results of two bonded LAN interfaces using the round-robin bonding mode.

Original languageEnglish
Title of host publicationInternational Conference on Communication Technology Proceedings, ICCT
DOIs
Publication statusPublished - 2006 Dec 1
Externally publishedYes
Event2006 International Conference on Communication Technology, ICCT '06 - Guilin, China
Duration: 2006 Nov 272006 Nov 30

Other

Other2006 International Conference on Communication Technology, ICCT '06
CountryChina
CityGuilin
Period06/11/2706/11/30

Fingerprint

Fault tolerance
Local area networks
Resource allocation
Interfaces (computer)
Linux
Throughput

ASJC Scopus subject areas

  • Engineering(all)
  • Computer Science(all)

Cite this

Aust, S., Kim, J-O., Davis, P., Yamaguchi, A., & Obana, S. (2006). Evaluation of linux bonding features. In International Conference on Communication Technology Proceedings, ICCT [4146536] https://doi.org/10.1109/ICCT.2006.341935

Evaluation of linux bonding features. / Aust, Stefan; Kim, Jong-Ok; Davis, Peter; Yamaguchi, Akira; Obana, Sadao.

International Conference on Communication Technology Proceedings, ICCT. 2006. 4146536.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Aust, S, Kim, J-O, Davis, P, Yamaguchi, A & Obana, S 2006, Evaluation of linux bonding features. in International Conference on Communication Technology Proceedings, ICCT., 4146536, 2006 International Conference on Communication Technology, ICCT '06, Guilin, China, 06/11/27. https://doi.org/10.1109/ICCT.2006.341935
Aust S, Kim J-O, Davis P, Yamaguchi A, Obana S. Evaluation of linux bonding features. In International Conference on Communication Technology Proceedings, ICCT. 2006. 4146536 https://doi.org/10.1109/ICCT.2006.341935
Aust, Stefan ; Kim, Jong-Ok ; Davis, Peter ; Yamaguchi, Akira ; Obana, Sadao. / Evaluation of linux bonding features. International Conference on Communication Technology Proceedings, ICCT. 2006.
@inproceedings{c9460fabf8714f9f90d7433315188b24,
title = "Evaluation of linux bonding features",
abstract = "The paper contains an evaluation of the current Linux bonding implementation for wired interfaces. The Linux bonding provides methods to aggregate multiple wired interfaces to support load balancing, fault-tolerance and throughput improvement. The intention is to identify the performance of the current Linux bonding implementation and to use the results and assumptions for future discussions about bonding of wireless interfaces. The paper presents details about interface bonding in a RedHat Linux system and discusses measurement results of two bonded LAN interfaces using the round-robin bonding mode.",
author = "Stefan Aust and Jong-Ok Kim and Peter Davis and Akira Yamaguchi and Sadao Obana",
year = "2006",
month = "12",
day = "1",
doi = "10.1109/ICCT.2006.341935",
language = "English",
isbn = "1424408016",
booktitle = "International Conference on Communication Technology Proceedings, ICCT",

}

TY - GEN

T1 - Evaluation of linux bonding features

AU - Aust, Stefan

AU - Kim, Jong-Ok

AU - Davis, Peter

AU - Yamaguchi, Akira

AU - Obana, Sadao

PY - 2006/12/1

Y1 - 2006/12/1

N2 - The paper contains an evaluation of the current Linux bonding implementation for wired interfaces. The Linux bonding provides methods to aggregate multiple wired interfaces to support load balancing, fault-tolerance and throughput improvement. The intention is to identify the performance of the current Linux bonding implementation and to use the results and assumptions for future discussions about bonding of wireless interfaces. The paper presents details about interface bonding in a RedHat Linux system and discusses measurement results of two bonded LAN interfaces using the round-robin bonding mode.

AB - The paper contains an evaluation of the current Linux bonding implementation for wired interfaces. The Linux bonding provides methods to aggregate multiple wired interfaces to support load balancing, fault-tolerance and throughput improvement. The intention is to identify the performance of the current Linux bonding implementation and to use the results and assumptions for future discussions about bonding of wireless interfaces. The paper presents details about interface bonding in a RedHat Linux system and discusses measurement results of two bonded LAN interfaces using the round-robin bonding mode.

UR - http://www.scopus.com/inward/record.url?scp=34547604510&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=34547604510&partnerID=8YFLogxK

U2 - 10.1109/ICCT.2006.341935

DO - 10.1109/ICCT.2006.341935

M3 - Conference contribution

AN - SCOPUS:34547604510

SN - 1424408016

SN - 9781424408016

BT - International Conference on Communication Technology Proceedings, ICCT

ER -