Experimental analysis of the process of anodic bonding using an evaporated glass layer

W. B. Choi, Byeong Kwon Ju, Yun-Hi Lee, M. R. Haskard, S. J. Jeong, N. Y. Lee, Man Young Sung, M. H. Oh

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

A silicon-to-silicon anodic bonding process using a glass layer deposited by electron beam evaporation will be described. Corning No.7740 Pyrex glass was used the source material of electron evaporation. From Auger electron spectroscopy (AES), the composition of the deposited glass layer is nearly same as that of the bulk Pyrex glass plate. Wafers are bonded at a temperature as low as 135°C with an applied voltage as small as 35V DC, enabling of this technique to be applied to vacuum packaging of microelectronic devices. Experimental results reveal that an evaporated glass layer of more than 1 μ m thick is suitable for anodic bonding. Finally, The role of sodium ions in anodic bonding was also studied by investigating the theoretical bonding mechanism and examining the results of secondary ion mass spectroscopy (SIMS) analysis.

Original languageEnglish
Title of host publicationMaterials Research Society Symposium - Proceedings
EditorsM.L. Reed, M. Elwenspoek, S. Johansson, E. Obermeier, H. Fujita, Y. Uenishi
PublisherMaterials Research Society
Pages173-178
Number of pages6
Volume444
Publication statusPublished - 1997
Externally publishedYes
EventProceedings of the 1996 MRS Fall Meeting - Boston, MA, USA
Duration: 1996 Dec 41996 Dec 5

Other

OtherProceedings of the 1996 MRS Fall Meeting
CityBoston, MA, USA
Period96/12/496/12/5

Fingerprint

Glass
Silicon
Evaporation
Ions
Auger electron spectroscopy
Microelectronics
Electron beams
Packaging
Sodium
Spectroscopy
Vacuum
Electrons
Electric potential
Chemical analysis
Temperature

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials

Cite this

Choi, W. B., Ju, B. K., Lee, Y-H., Haskard, M. R., Jeong, S. J., Lee, N. Y., ... Oh, M. H. (1997). Experimental analysis of the process of anodic bonding using an evaporated glass layer. In M. L. Reed, M. Elwenspoek, S. Johansson, E. Obermeier, H. Fujita, & Y. Uenishi (Eds.), Materials Research Society Symposium - Proceedings (Vol. 444, pp. 173-178). Materials Research Society.

Experimental analysis of the process of anodic bonding using an evaporated glass layer. / Choi, W. B.; Ju, Byeong Kwon; Lee, Yun-Hi; Haskard, M. R.; Jeong, S. J.; Lee, N. Y.; Sung, Man Young; Oh, M. H.

Materials Research Society Symposium - Proceedings. ed. / M.L. Reed; M. Elwenspoek; S. Johansson; E. Obermeier; H. Fujita; Y. Uenishi. Vol. 444 Materials Research Society, 1997. p. 173-178.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Choi, WB, Ju, BK, Lee, Y-H, Haskard, MR, Jeong, SJ, Lee, NY, Sung, MY & Oh, MH 1997, Experimental analysis of the process of anodic bonding using an evaporated glass layer. in ML Reed, M Elwenspoek, S Johansson, E Obermeier, H Fujita & Y Uenishi (eds), Materials Research Society Symposium - Proceedings. vol. 444, Materials Research Society, pp. 173-178, Proceedings of the 1996 MRS Fall Meeting, Boston, MA, USA, 96/12/4.
Choi WB, Ju BK, Lee Y-H, Haskard MR, Jeong SJ, Lee NY et al. Experimental analysis of the process of anodic bonding using an evaporated glass layer. In Reed ML, Elwenspoek M, Johansson S, Obermeier E, Fujita H, Uenishi Y, editors, Materials Research Society Symposium - Proceedings. Vol. 444. Materials Research Society. 1997. p. 173-178
Choi, W. B. ; Ju, Byeong Kwon ; Lee, Yun-Hi ; Haskard, M. R. ; Jeong, S. J. ; Lee, N. Y. ; Sung, Man Young ; Oh, M. H. / Experimental analysis of the process of anodic bonding using an evaporated glass layer. Materials Research Society Symposium - Proceedings. editor / M.L. Reed ; M. Elwenspoek ; S. Johansson ; E. Obermeier ; H. Fujita ; Y. Uenishi. Vol. 444 Materials Research Society, 1997. pp. 173-178
@inproceedings{c6b79d7f9b134272b505b15d5497c68d,
title = "Experimental analysis of the process of anodic bonding using an evaporated glass layer",
abstract = "A silicon-to-silicon anodic bonding process using a glass layer deposited by electron beam evaporation will be described. Corning No.7740 Pyrex glass was used the source material of electron evaporation. From Auger electron spectroscopy (AES), the composition of the deposited glass layer is nearly same as that of the bulk Pyrex glass plate. Wafers are bonded at a temperature as low as 135°C with an applied voltage as small as 35V DC, enabling of this technique to be applied to vacuum packaging of microelectronic devices. Experimental results reveal that an evaporated glass layer of more than 1 μ m thick is suitable for anodic bonding. Finally, The role of sodium ions in anodic bonding was also studied by investigating the theoretical bonding mechanism and examining the results of secondary ion mass spectroscopy (SIMS) analysis.",
author = "Choi, {W. B.} and Ju, {Byeong Kwon} and Yun-Hi Lee and Haskard, {M. R.} and Jeong, {S. J.} and Lee, {N. Y.} and Sung, {Man Young} and Oh, {M. H.}",
year = "1997",
language = "English",
volume = "444",
pages = "173--178",
editor = "M.L. Reed and M. Elwenspoek and S. Johansson and E. Obermeier and H. Fujita and Y. Uenishi",
booktitle = "Materials Research Society Symposium - Proceedings",
publisher = "Materials Research Society",

}

TY - GEN

T1 - Experimental analysis of the process of anodic bonding using an evaporated glass layer

AU - Choi, W. B.

AU - Ju, Byeong Kwon

AU - Lee, Yun-Hi

AU - Haskard, M. R.

AU - Jeong, S. J.

AU - Lee, N. Y.

AU - Sung, Man Young

AU - Oh, M. H.

PY - 1997

Y1 - 1997

N2 - A silicon-to-silicon anodic bonding process using a glass layer deposited by electron beam evaporation will be described. Corning No.7740 Pyrex glass was used the source material of electron evaporation. From Auger electron spectroscopy (AES), the composition of the deposited glass layer is nearly same as that of the bulk Pyrex glass plate. Wafers are bonded at a temperature as low as 135°C with an applied voltage as small as 35V DC, enabling of this technique to be applied to vacuum packaging of microelectronic devices. Experimental results reveal that an evaporated glass layer of more than 1 μ m thick is suitable for anodic bonding. Finally, The role of sodium ions in anodic bonding was also studied by investigating the theoretical bonding mechanism and examining the results of secondary ion mass spectroscopy (SIMS) analysis.

AB - A silicon-to-silicon anodic bonding process using a glass layer deposited by electron beam evaporation will be described. Corning No.7740 Pyrex glass was used the source material of electron evaporation. From Auger electron spectroscopy (AES), the composition of the deposited glass layer is nearly same as that of the bulk Pyrex glass plate. Wafers are bonded at a temperature as low as 135°C with an applied voltage as small as 35V DC, enabling of this technique to be applied to vacuum packaging of microelectronic devices. Experimental results reveal that an evaporated glass layer of more than 1 μ m thick is suitable for anodic bonding. Finally, The role of sodium ions in anodic bonding was also studied by investigating the theoretical bonding mechanism and examining the results of secondary ion mass spectroscopy (SIMS) analysis.

UR - http://www.scopus.com/inward/record.url?scp=0030643769&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0030643769&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:0030643769

VL - 444

SP - 173

EP - 178

BT - Materials Research Society Symposium - Proceedings

A2 - Reed, M.L.

A2 - Elwenspoek, M.

A2 - Johansson, S.

A2 - Obermeier, E.

A2 - Fujita, H.

A2 - Uenishi, Y.

PB - Materials Research Society

ER -