By using a substrate transferring technique, poly-diamond thick films having a smooth or rough surface could be fabricated as field emitter materials. The diamond film with a smooth surface, which was transferred from the interface between the (100) Si substrate and poly-diamond deposited by plasma-enhanced CVD, showed better field emission properties in terms of emission current density with improved vacuum level dependence as compared with original poly-diamond film from a rough surface.
|Number of pages||5|
|Publication status||Published - 1998 Nov 1|
- Field emission
ASJC Scopus subject areas
- Control and Systems Engineering
- Electrical and Electronic Engineering