Fabrication and field emission properties of poly-diamond films

Byeong Kwon Ju, Yun-Hi Lee, Myung Hwan Oh

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

By using a substrate transferring technique, poly-diamond thick films having a smooth or rough surface could be fabricated as field emitter materials. The diamond film with a smooth surface, which was transferred from the interface between the (100) Si substrate and poly-diamond deposited by plasma-enhanced CVD, showed better field emission properties in terms of emission current density with improved vacuum level dependence as compared with original poly-diamond film from a rough surface.

Original languageEnglish
Pages (from-to)855-859
Number of pages5
JournalMicroelectronics Journal
Volume29
Issue number11
Publication statusPublished - 1998 Nov 1
Externally publishedYes

Fingerprint

Diamond films
diamond films
Field emission
field emission
Fabrication
fabrication
diamonds
Diamond
Substrates
Plasma enhanced chemical vapor deposition
Thick films
thick films
Diamonds
emitters
Current density
vapor deposition
Vacuum
current density
vacuum

Keywords

  • Diamond
  • Field emission
  • Film

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

Cite this

Fabrication and field emission properties of poly-diamond films. / Ju, Byeong Kwon; Lee, Yun-Hi; Oh, Myung Hwan.

In: Microelectronics Journal, Vol. 29, No. 11, 01.11.1998, p. 855-859.

Research output: Contribution to journalArticle

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