@inproceedings{d8c65ab35393482296af7438d9951e21,
title = "Fabrication and wafer-level packaging of Si electrostatic microgripper for micro assembly",
abstract = "The wafer-level packaging of electrostatic Si microgripper was investigated. It is important to ensure safe handling and damage free during fabrication and assembly of micro devices. Some reliability problems have been occurred during packaging or handling of the microgripper regardless of actuation principles. After pre-release of sacrificial layer, a new wafer-level packaging was processed by anodic bonding between a glass wafer with through-holes and a Si wafer device. A laser dicing has been performed before wire bonding for damage free during both dicing and packaging process. After the laser dicing, post-releasing has been done. The diced chips were actuated by applied voltage from 0 V dc to 15 V dc. The jaws of fabricated microgripper have been actuated from 0 μmt o 25 μm.",
keywords = "Electrostatic, Microgripper, Wafer-Level packaging",
author = "Kunnyun Kim and Yoon, {Hyun Myoung} and Lee, {Kang Ryeol} and Park, {Joon Shik} and Hyoderk Park and Chanwoo Moon and Lee, {In Gyu} and Joungho Park",
year = "2005",
language = "English",
isbn = "0780389948",
series = "Digest of Technical Papers - International Conference on Solid State Sensors and Actuators and Microsystems, TRANSDUCERS '05",
pages = "952--955",
booktitle = "TRANSDUCERS '05 - 13th International Conference on Solid-State Sensors and Actuators and Microsystems - Digest of Technical Papers",
note = "13th International Conference on Solid-State Sensors and Actuators and Microsystems, TRANSDUCERS '05 ; Conference date: 05-06-2005 Through 09-06-2005",
}