Fabrication and wafer-level packaging of Si electrostatic microgripper for micro assembly

Kunnyun Kim, Hyun Myoung Yoon, Kang Ryeol Lee, Joon Shik Park, Hyoderk Park, Chanwoo Moon, In Gyu Lee, Joungho Park

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

The wafer-level packaging of electrostatic Si microgripper was investigated. It is important to ensure safe handling and damage free during fabrication and assembly of micro devices. Some reliability problems have been occurred during packaging or handling of the microgripper regardless of actuation principles. After pre-release of sacrificial layer, a new wafer-level packaging was processed by anodic bonding between a glass wafer with through-holes and a Si wafer device. A laser dicing has been performed before wire bonding for damage free during both dicing and packaging process. After the laser dicing, post-releasing has been done. The diced chips were actuated by applied voltage from 0 V dc to 15 V dc. The jaws of fabricated microgripper have been actuated from 0 μmt o 25 μm.

Original languageEnglish
Title of host publicationTRANSDUCERS '05 - 13th International Conference on Solid-State Sensors and Actuators and Microsystems - Digest of Technical Papers
Pages952-955
Number of pages4
Publication statusPublished - 2005
Event13th International Conference on Solid-State Sensors and Actuators and Microsystems, TRANSDUCERS '05 - Seoul, Korea, Republic of
Duration: 2005 Jun 52005 Jun 9

Publication series

NameDigest of Technical Papers - International Conference on Solid State Sensors and Actuators and Microsystems, TRANSDUCERS '05
Volume1

Other

Other13th International Conference on Solid-State Sensors and Actuators and Microsystems, TRANSDUCERS '05
CountryKorea, Republic of
CitySeoul
Period05/6/505/6/9

Keywords

  • Electrostatic
  • Microgripper
  • Wafer-Level packaging

ASJC Scopus subject areas

  • Engineering(all)

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