Fabrication of ceramic-based passive mixers for microfluidic application by thick film lithography

Jaekyung Choi, Young Joon Yoon, Jong Woo Lim, Hyo Tae Kim, Eun Hae Koo, Youn Suk Choi, Jong Heun Lee, Jong Hee Kim

Research output: Contribution to journalArticle

Abstract

Microfluidic device can be applied in a wide range of chemical and biological technology. In this paper, ceramic-based T-type passive mixers for microfluidic applications were fabricated by LTCC process combined with thick film photolithography. The base ceramic material in thick film was amorphous cordierite ((Mg,Ca)2Al4Si5O18) and photoimageable polymers were added to give a photosensitivity. Two types of passive mixer, which showed the channel width of 1.0 mm and 200 um, respectively, were designed considering mixing efficiency in the channel and their microfluidic properties were discussed in detail.

Original languageEnglish
Pages (from-to)739-743
Number of pages5
JournalJournal of the Korean Ceramic Society
Volume45
Issue number11
DOIs
Publication statusPublished - 2008 Nov 1

Fingerprint

Thick films
Microfluidics
Lithography
Fabrication
Photosensitivity
Photolithography
Ceramic materials
Polymers

Keywords

  • Ceramic passive mixer
  • Cordierite
  • Microfluidics
  • Photoimageable paste
  • Photolithography

ASJC Scopus subject areas

  • Ceramics and Composites

Cite this

Fabrication of ceramic-based passive mixers for microfluidic application by thick film lithography. / Choi, Jaekyung; Yoon, Young Joon; Lim, Jong Woo; Kim, Hyo Tae; Koo, Eun Hae; Choi, Youn Suk; Lee, Jong Heun; Kim, Jong Hee.

In: Journal of the Korean Ceramic Society, Vol. 45, No. 11, 01.11.2008, p. 739-743.

Research output: Contribution to journalArticle

Choi, Jaekyung ; Yoon, Young Joon ; Lim, Jong Woo ; Kim, Hyo Tae ; Koo, Eun Hae ; Choi, Youn Suk ; Lee, Jong Heun ; Kim, Jong Hee. / Fabrication of ceramic-based passive mixers for microfluidic application by thick film lithography. In: Journal of the Korean Ceramic Society. 2008 ; Vol. 45, No. 11. pp. 739-743.
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