For miniaturisation and precision of electronic device, the new technologies such as photoimageable thick film process were combined with conventional thick film process, and constrained sintering with near zero shrinkage in the x and y direction has been proposed. In this research, photoimageable conductive paste for forming embedded components via constrained sintering by low temperature cofired ceramic (LTCC) technology was formulated. Afterwards, by optimising paste formulation, formation process of fine line and sintering method, miniaturised LTCC components especially embedded fine line inductors were fabricated and their properties such as line resolution, surface morphology and yield were investigated. As a result, embedded fine line inductors formed by constrained sintering with fine line resolution of 20 μm and yield over 90% were acquired.
- Constrained sintering
- Embedded inductor
- Photoimageable conductive paste
- Photoimageable thick film
ASJC Scopus subject areas
- Ceramics and Composites
- Industrial and Manufacturing Engineering