Fabrication of highly ordered multilayer films using a spin self-assembly method

Jinhan Cho, K. Char, J. D. Hong, K. B. Lee

Research output: Contribution to journalArticle

354 Citations (Scopus)

Abstract

The spin self-assembly (SA) process utilizing interactions which causes adsorption, the rearrangement of polymer chains onto a substrate, and the desorption of weakly bound chains in a very short time of approximately 10 s was demonstrated. This new ultrathin film-forming process yields a highly ordered internal structure far superior to the structure obtained with the dip SA process. In addition, it allows to predict and control precisely the bilayer thickness as well as the surface roughness.

Original languageEnglish
Pages (from-to)1076-1078
Number of pages3
JournalAdvanced Materials
Volume13
Issue number14
DOIs
Publication statusPublished - 2001 Jul 18
Externally publishedYes

Fingerprint

Multilayer films
Self assembly
Fabrication
Ultrathin films
Desorption
Polymers
Surface roughness
Adsorption
Substrates

ASJC Scopus subject areas

  • Materials Science(all)

Cite this

Fabrication of highly ordered multilayer films using a spin self-assembly method. / Cho, Jinhan; Char, K.; Hong, J. D.; Lee, K. B.

In: Advanced Materials, Vol. 13, No. 14, 18.07.2001, p. 1076-1078.

Research output: Contribution to journalArticle

Cho, Jinhan ; Char, K. ; Hong, J. D. ; Lee, K. B. / Fabrication of highly ordered multilayer films using a spin self-assembly method. In: Advanced Materials. 2001 ; Vol. 13, No. 14. pp. 1076-1078.
@article{9ed94df00d1943dda45ad322e075961b,
title = "Fabrication of highly ordered multilayer films using a spin self-assembly method",
abstract = "The spin self-assembly (SA) process utilizing interactions which causes adsorption, the rearrangement of polymer chains onto a substrate, and the desorption of weakly bound chains in a very short time of approximately 10 s was demonstrated. This new ultrathin film-forming process yields a highly ordered internal structure far superior to the structure obtained with the dip SA process. In addition, it allows to predict and control precisely the bilayer thickness as well as the surface roughness.",
author = "Jinhan Cho and K. Char and Hong, {J. D.} and Lee, {K. B.}",
year = "2001",
month = "7",
day = "18",
doi = "10.1002/1521-4095(200107)13:14<1076::AID-ADMA1076>3.0.CO;2-M",
language = "English",
volume = "13",
pages = "1076--1078",
journal = "Advanced Materials",
issn = "0935-9648",
publisher = "Wiley-VCH Verlag",
number = "14",

}

TY - JOUR

T1 - Fabrication of highly ordered multilayer films using a spin self-assembly method

AU - Cho, Jinhan

AU - Char, K.

AU - Hong, J. D.

AU - Lee, K. B.

PY - 2001/7/18

Y1 - 2001/7/18

N2 - The spin self-assembly (SA) process utilizing interactions which causes adsorption, the rearrangement of polymer chains onto a substrate, and the desorption of weakly bound chains in a very short time of approximately 10 s was demonstrated. This new ultrathin film-forming process yields a highly ordered internal structure far superior to the structure obtained with the dip SA process. In addition, it allows to predict and control precisely the bilayer thickness as well as the surface roughness.

AB - The spin self-assembly (SA) process utilizing interactions which causes adsorption, the rearrangement of polymer chains onto a substrate, and the desorption of weakly bound chains in a very short time of approximately 10 s was demonstrated. This new ultrathin film-forming process yields a highly ordered internal structure far superior to the structure obtained with the dip SA process. In addition, it allows to predict and control precisely the bilayer thickness as well as the surface roughness.

UR - http://www.scopus.com/inward/record.url?scp=0035908536&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0035908536&partnerID=8YFLogxK

U2 - 10.1002/1521-4095(200107)13:14<1076::AID-ADMA1076>3.0.CO;2-M

DO - 10.1002/1521-4095(200107)13:14<1076::AID-ADMA1076>3.0.CO;2-M

M3 - Article

VL - 13

SP - 1076

EP - 1078

JO - Advanced Materials

JF - Advanced Materials

SN - 0935-9648

IS - 14

ER -