Fabrication of inkjet printed flexible electronics by low temperature subtractive laser processing

Seung Hwan Ko, Jaewon Chung, Yeonho Choi, Costas P. Grigoropoulos, Dimos Poulikakos

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

The low temperature fabrication of passive electrical components (resistor, capacitor) on flexible substrates is presented in this paper. A drop-on-demand (DOD) ink-jetting system was used to print passive electrical components from gold nano-particles suspended in Alpha-Terpineol solution on a flexible polymer substrate. PVP (poly-4-vinylphenol) in PGMEA (propylene glycol monomethyl ether acetate) solvent was inkjet-printed as dielectric layer for capacitor. A pulsed laser beam was irradiated to produce finer electrical components, thereby overcoming the inherent limitation of inkjet processing. A continuous Ar laser beam was irradiated locally to evaporate carrier solvent as well as to cure the gold nano-particles in order to improve the electrical resistivity. Conductor lines and capacitors were fabricated on polymer substrate and their performance was analyzed.

Original languageEnglish
Title of host publicationAmerican Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP
Pages599-603
Number of pages5
Volume5
DOIs
Publication statusPublished - 2005 Dec 1
Event2005 ASME International Mechanical Engineering Congress and Exposition, IMECE - Orlando, FL, United States
Duration: 2005 Nov 52005 Nov 11

Other

Other2005 ASME International Mechanical Engineering Congress and Exposition, IMECE
CountryUnited States
CityOrlando, FL
Period05/11/505/11/11

Keywords

  • Flexible electronics
  • Gold
  • Inkjet
  • Laser ablation and sintering
  • Nanoparticle

ASJC Scopus subject areas

  • Mechanical Engineering
  • Electrical and Electronic Engineering

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  • Cite this

    Ko, S. H., Chung, J., Choi, Y., Grigoropoulos, C. P., & Poulikakos, D. (2005). Fabrication of inkjet printed flexible electronics by low temperature subtractive laser processing. In American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP (Vol. 5, pp. 599-603) https://doi.org/10.1115/IMECE2005-80535