Fabrication of nano-sized gold dot array using Bi-layer nano imprint lithography

Ki Yeon Yang, Sung Hoon Hong, Heon Lee, Jeong Woo Choi

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

3 Citations (Scopus)

Abstract

UV nano imprint lithography (UV NIL) that uses a monomer based UV curable monomer resin is proposed as a method of imprinting at low temperature and pressure. The fabrication of high fidelity patterns on a topographical substrate is a formidable challenge. To accomplish this, the use of bi-layer nano imprint lithography, which involves the use of an easily removable under-layer and an imprinted pattern, is proposed. We hypothesized that by etching the under layer by oxygen RIE, we might be able to build the bi-layer patterns for easy lift-off and fabricate nano-sized metal patterns through this lift-off process.

Original languageEnglish
Title of host publicationEco-Materials Processing and Design VII - Proceedings of the Conference of the 7th International Symposium on Eco-Materials Processing and Design, ISEPD-7
PublisherTrans Tech Publications Ltd
Pages446-449
Number of pages4
ISBN (Print)0878499954, 9780878499953
DOIs
Publication statusPublished - 2006
Event7th International Symposium on Eco-Materials Processing and Design, ISEPD-7 - Chengdu, China
Duration: 2006 Jan 8 → 2006 Jan 11

Publication series

NameMaterials Science Forum
Volume510-511
ISSN (Print)0255-5476
ISSN (Electronic)1662-9752

Other

Other7th International Symposium on Eco-Materials Processing and Design, ISEPD-7
CountryChina
CityChengdu
Period06/1/8 → 06/1/11

Keywords

  • Bi-layer imprinting
  • LOL ™2000
  • Lift-off
  • UV nano imprint lithography

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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    Yang, K. Y., Hong, S. H., Lee, H., & Choi, J. W. (2006). Fabrication of nano-sized gold dot array using Bi-layer nano imprint lithography. In Eco-Materials Processing and Design VII - Proceedings of the Conference of the 7th International Symposium on Eco-Materials Processing and Design, ISEPD-7 (pp. 446-449). (Materials Science Forum; Vol. 510-511). Trans Tech Publications Ltd. https://doi.org/10.4028/0-87849-995-4.446