Fabrication of one-dimensional devices by a combination of AC dielectrophoresis and electrochemical deposition

S. H. Hong, M. G. Kang, H. Y. Cha, M. H. Son, J. S. Hwang, H. J. Lee, Sanghoon Sull, S. W. Hwang, D. Whang, D. Ahn

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16 Citations (Scopus)

Abstract

We demonstrate a hybrid process for fabricating one-dimensional wire devices. The process is a combination of an alignment procedure using dielectrophoresis and subsequent contact metal formation utilizing electrochemical deposition with non-toxic organic-based Au electrolytes. Several devices have been successfully made from GaN nanowires or multi-walled carbon nanotubes (MWCNTs) using our hybrid technique. We demonstrate that rapid thermal annealing improves the ohmic characteristics by five orders of magnitude in the case of the GaN devices and ∼300% in the case of the MWCNT devices. One of the reasons for this improvement is enhanced gold wetting due to the reduction of grain size at the annealing temperature.

Original languageEnglish
Article number105305
JournalNanotechnology
Volume19
Issue number10
DOIs
Publication statusPublished - 2008 Mar 12

ASJC Scopus subject areas

  • Bioengineering
  • Chemistry(all)
  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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    Hong, S. H., Kang, M. G., Cha, H. Y., Son, M. H., Hwang, J. S., Lee, H. J., Sull, S., Hwang, S. W., Whang, D., & Ahn, D. (2008). Fabrication of one-dimensional devices by a combination of AC dielectrophoresis and electrochemical deposition. Nanotechnology, 19(10), [105305]. https://doi.org/10.1088/0957-4484/19/10/105305