Fabrication of stabilized piezoelectric thick film for silicon-based MEMS device

T. Y. Kwon, Y. B. Kim, K. Eom, D. S. Yoon, H. L. Lee, T. S. Kim

Research output: Contribution to journalArticle

10 Citations (Scopus)

Abstract

Electrical properties of piezoelectric thick films with controlled microstructure were investigated. In order to enhance the electromechanical properties (e.g. d31, d33) of a thick film by control of its microstructure, a mixed powder, referred to as BNP, consisting of both nano-sized and micro-sized piezoelectric particles, was employed as a starting precursor in the film fabrication process. According to a scanning electron microscopy study, it is shown that a BNP thick film exhibits the densest homogeneous microstructures. According to surface area measurements, the BNP thick film was sufficiently densified without an additional infiltration process of Pb(Zr1-xTix)O3 sol for densification. The screen-printed BNP thick film possesses a dielectric constant and a remanent polarization much higher than those of a thick film composed of only micro-sized piezoelectric particles by a factor of more than two. This suggests the potential application of the BNP thick film, in conjunction with a silicon substrate, to a micromachined monolithic PZT thick film device on the silicon substrate.

Original languageEnglish
Pages (from-to)627-632
Number of pages6
JournalApplied Physics A: Materials Science and Processing
Volume88
Issue number4
DOIs
Publication statusPublished - 2007 Sep

ASJC Scopus subject areas

  • Chemistry(all)
  • Materials Science(all)

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