Fabrication of Sub-50 nm Au nanowires using thermally curing nanoimprint lithography

Sung Hoon Hong, Byeong Ju Bae, Ki Yeon Yang, Jun Ho Jeong, Hyeong Seok Kim, Heon Lee

Research output: Contribution to journalArticle

17 Citations (Scopus)

Abstract

As narrow as 50 nm metal nanowire array patterns were successfully fabricated by nanoimprint lithography (NIL) using thermally curable monomer based resin. Compared to conventional hot embossing lithography, which has used thermoplastic polymers such as PMMA as an imprint resin and thus process temperature and pressure are over 180°C and 50 bar, respectively, thermally curable monomer based resin enabled imprint process at relatively lower temperature (120°C) and pressure (20 bar). Due to the highly fluidic nature of monomer based liquid phase resin, residual layer was not observed after imprinting. Imprinted resist pattern was then treated with oxygen plasma for 5 seconds and 5 nm of Ti layer and 15 nm of Au layer was deposited by e-beam evaporation. The imprinted resist pattern was lifted-off by dipping into an organic solvent, such as acetone. As the result, as narrow as 50 nm Au nanowire array pattern with area of 30 mm×40 mm was fabricated on a Si substrate. 30 mm × 40 mm of nanowire pattern area was not limited by nanoimprint process, but the laser interference lithography process, which was used to fabricated the master template for imprinting.

Original languageEnglish
Pages (from-to)139-143
Number of pages5
JournalElectronic Materials Letters
Volume5
Issue number4
DOIs
Publication statusPublished - 2009 Dec

Keywords

  • Au nanowire array
  • Hot embossing lithography
  • Lift-off process
  • Nanoimprint lithography
  • Thermally curable liquid phase resin
  • Zero-residual imprint

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials

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